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Green Polyester film, single coated with a rubber resin pressure sensitive adhesive. APPLICATIONS Masking in powder coating applications. Protects large areas of circuit boards from chemicals fumes or splashes. Masking of circuit boards during solder stripping and nickel/gold plating of contact fingers. PRODUCT BENEFITS Resists baking temperatures of 170°C to 190°C during 20min. Operating temperature range: ‐30°C to 130°C. Eliminates silicone contamination and need for PCB cleaning solvents. Easy application and removal. Non‐silicone adhesive removes cleanly. Good adhesion to substrate. Excellent conformability.
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APPLICATIONS (D601) Bonds a wide variety of similar and dissimilar substrates. Bonds EPDM rubber profile or weather strips. Bonds sound dampening materials. Suitable for foam gasketing and more especially ester, ether and urethane foams. Suitable for difficult splicing applications, especially low surface energy substrates like polyethylene and polypropylene. PRODUCT BENEFITS Easy hand tearable. Good dimensional stability. Exceptionally high tack and peel adhesion. Excellent resistance to environmental extremes. Good plasticizer resistance. Thin bonding solution. Service temperature: ‐40°C to +95°C (short tem +125°C).
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