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APPLICATIONS (D601) Bonds a wide variety of similar and dissimilar substrates. Bonds EPDM rubber profile or weather strips. Bonds sound dampening materials. Suitable for foam gasketing and more especially ester, ether and urethane foams. Suitable for difficult splicing applications, especially low surface energy substrates like polyethylene and polypropylene. PRODUCT BENEFITS Easy hand tearable. Good dimensional stability. Exceptionally high tack and peel adhesion. Excellent resistance to environmental extremes. Good plasticizer resistance. Thin bonding solution. Service temperature: ‐40°C to +95°C (short tem +125°C).
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