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IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

Bondable platinum 1000 Ohm RTD component Nominal resistance 1000 Ω at 0 °C Operating temperature range —50 °C to +150 °C TCR Pt 3850 ppm/K Chip size/dimensions 0.75 x 0.75 x 0.3 mm Tolerance/class IEC 60751 F0.3 (IST AG tolerance class B) Connection type Bondable pads (Au) Packaging Chip tray, sensor-side up

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​

• According to DIN EN 61810-1, DIN EN 61810-3, DIN EN 45545 (fire protection on railway vehicles) • With forcibly guided contacts • Safe separation betwenn coil/contact and contact/contact for applications at pollution degree 2 with rated insulation voltage 250 V • Clearance and creepage distances contact - coil ≥ 5.5 mm contact - contact ≥ 5.5 mm • Low nominal and holding power • High mechanical service life • Extremly smallest height only 10.3 mm and minimum area • RoHS compliance • Placing SMD components between PCB and relay is possible

• According to DIN EN 61810-1, DIN EN 61810-3, DIN EN 45545 (fire protection on railway vehicles) • With forcibly guided contacts • Safe separation betwenn coil/contact and contact/contact for applications at pollution degree 2 with rated insulation voltage 250 V • Clearance and creepage distances contact - coil ≥ 5.5 mm contact - contact ≥ 5.5 mm • Low nominal and holding power • High mechanical service life • Extremly smallest height only 10.3 mm and minimum area • RoHS compliance • Placing SMD components between PCB and relay is possible

• According to DIN EN 61810-1, DIN EN 61810-3, DIN EN 45545 (fire protection on railway vehicles) • With forcibly guided contacts • Safe separation betwenn coil/contact and contact/contact for applications at pollution degree 2 with rated insulation voltage 250 V • Clearance and creepage distances contact - coil ≥ 5.5 mm contact - contact ≥ 5.5 mm • Low nominal and holding power • High mechanical service life • Extremly smallest height only 10.3 mm and minimum area • RoHS compliance • Placing SMD components between PCB and relay is possible

• Universal use with various enclosure types • High current (5 A per bus pcb-rail) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

• Universal use with various enclosure types • High current (5 A per power cable) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

• Universal use with various enclosure types • High current (5 A per pcb-rail) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be adapted according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Optional coding of the bus system to prevent incorrect assembly • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

• Universal use with various enclosure types • High current (5 A per bus pcb-rail) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

DATAPAQ Reflow Tracker temperature profiling systems Program includes — range of high-accuracy, industrial-strength, compact Datapaq DP5 data loggers — range of low-height thermal barriers — DATAPAQ Insight Reflow Tracker analysis software — selection of fast-response, high-temperature thermocouples for measuring SMD and PCB temperatures and process stability Applications include — WAVE SOLDERING – accessory: DATAPAQ wave pallet with up to 9 contact sensors and 3 preheat sensors; software functions include contact times and parallelism — SELECTIVE SOLDERING – accessory: DATAPAQ PA2200 selective soldering sensor for process stability measurement — VACUUM SOLDERING – optional data transmission via radio enables real-time data analysis — VAPOR PHASE SOLDERING – program includes a special range of sealed and lighter-weight thermal barriers — REWORK STATIONS – the DATAPAQ DP5 data logger with its USB and Bluetooth connectivity is ideal for high-speed, real-time monitoring

In the area of PCB assembly, KUK Group offers SMD and THT assembly lines, where we manufacture according to the customers' requirements. For quality inspection, we use automated optical inspection systems (AOI), an X-ray machine and manual optical inspection. KUK Group assembles printed circuit boards that are used in a wide variety of applications. As a purely customer-specific manufacturing partner, we also provide our well-known individual and high-quality service in PCB assembly, gladly also for small series. KUK thus offers you electronics from a single source in addition to winding goods. On our fully automatic surface mount device lines (SMD), we take care of the PCB assembly for you. Various soldering systems round off our range in the area of SMD PCB assembly. -Rigid, flexible circuit boards -Aluminum circuit boards -Component size starting at 0201 -Fine pitch -Lead-free -Double sided SMD, THT assembly -Mixed THT, SMD assembly -Tracked assembly

Suitable for every order size: SMD assembly is one of our core competencies Our SMD assembly is characterized by modern production standards and a low error rate. Stencil printers and a jet printer are available in front of our three production lines. This means that we are as flexible as possible when preparing your project. The SMD components are precisely applied in our pick and place machines and soldered in reflow ovens, or in special cases also in our vapor phase. A highlight: We have a hybrid assembly machine, the FUJI 7x NXT2. This is our way to work with the greatest precision, quickly and safely. What speaks for us: -Your Contact person for prototypes, large or small series -A high mix of components is not a problem -We test the technical feasibility of your project before each order -We are not just a service provider, but a technology partner: A+B Electronic thinks through your project with you and together we can bring it to successful series production