Silicone films - Import export

ACTIVE INGREDIENTS Myo-Inositol Magnesium Iron Copper Folic Acid Vitamin B12 Vitamin C Excipients: Diluent: Dicalcium Phosphate, Microcrystalline Cellulose; Binder: Polyvinylpyrollidon, Maize Starch; Glidant: Colloidal Silicon Dioxide; Lubricant: Magnesium Stearate, Film Coating Agent.

ACTIVE INGREDIENTS Myo-Inositol D-Chiro-Inositol Chromium Calcium Vitamin D3 Excipients: Diluent: Microcrystalline Cellulose; Binder: Polyvinylpyrollidon; Disintegrant: Croscarmelloz Sodium; Glidant: Colloidal Silicon Dioxide; Lubricant: Magnesium Stearate, Film Coating Agent.

ACTIVE INGREDIENTS Coenzim Q10 Korean Ginseng Extract Serenoa Repens Extract Chromium Molibden Manganese Copper Selenium Calcium Zinc Vitamin A Vitamin B1 Vitamin B2 Vitamin B3 Vitamin B6 Vitamin B7 Vitamin B9 Vitamin B12 Vitamin C Vitamin D3 Vitamin E Excipients: Diluent: Microcrystalline Cellulose; Binder: Polyvinylpyrollidon; Glidant: Colloidal Silicon Dioxide; Lubricant: Magnesium Stearate,Film Coating Agent.

ACTIVE INGREDIENTS Coenzim Q10 Vaccinium Myrtillus Extract Alpha Lipoic Acid Chromium Molibden Manganese Copper Selenium Calcium Zinc Iron Vitamin A Vitamin B1 Vitamin B2 Vitamin B3 Vitamin B6 Vitamin B7 Vitamin B9 Vitamin B12 Vitamin C Vitamin D3 Vitamin E Excipients: Diluent: Microcrystalline Cellulose; Binder: Polyvinylpyrollidon; Glidant: Colloidal Silicon Dioxide; Lubricant: Magnesium Stearate,Film Coating Agent.

Product Identification Chemical name: 1,1-Dichlorosilacyclobutane Synonyms: 1,1-Dichlorosilacyclobutane, Cyclotrimethylenedichlorosilane, 1,1-Dichlorosiletane CAS No.: 2351-33-9 Molecular formula: C3H6Cl2Si Molecular weight: 141.07 Boiling point: 113-114 ℃ Density: 1.196 g/mL Refractive index: 1.462 Specification Appearance: Colorless transparent liquid Purity: 97.00%min by GC Package Regular Packing: N.W 1kg/steel bottle Sample Packing: 0.1kg-0.5kg steel bottle Transportation Information Classification: Class 4.3(3+8) dangerous goods UN 2988 PG I HS Code: 2931900090 Status & Application Status Commercial available Application: 1) Used to synthesize Olefin Polymer catalyst; 2) Used to produce hydrogenated silicon oxycarbide (H:SiOC) films having low dielectric constant; 3) Used to produce polycyclosiloxanes containing silacyclobutane;

Green Polyester film, single coated with a rubber resin pressure sensitive adhesive. APPLICATIONS Masking in powder coating applications. Protects large areas of circuit boards from chemicals fumes or splashes. Masking of circuit boards during solder stripping and nickel/gold plating of contact fingers. PRODUCT BENEFITS Resists baking temperatures of 170°C to 190°C during 20min. Operating temperature range: ‐30°C to 130°C. Eliminates silicone contamination and need for PCB cleaning solvents. Easy application and removal. Non‐silicone adhesive removes cleanly. Good adhesion to substrate. Excellent conformability.

most outstanding properties are its high dielectric and tensile strength, which make it an extremely durable insulation tape. The high-temperature properties of the PTFE and silicone adhesive allow it to perform in continuous temperatures up to 260°C (500°F). As high-modulus tape, also exhibits low elongation which enables it to be applied with automatic wrapping equipment. The other outstanding features of include chemical inertness as well as low-friction, anti-stick and non-toxic properties, making it the right material for numerous applications Thickness 0.089 mm 0.114 mm 0.165 mm 0.191 mm

Kapton and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board

is a 23µ m clear polyester film double coated with a special formulated silicone adhesive on the closed side and an acrylic adhesive on the open side, with 110µm total thickness excluding liners. The product has a siliconised paper liner on the acrylic side, and a fluoro siliconised PET liner on the silicone adhesive side. APPLICATIONS Bonds silicone substrates like elastomer joints, foams, gaskets and profiles. Bonds silicone rubber profile or weather strips on to high surface energy materials such as metal, engineered plastics, glass or wood. Bonds difficult to adhere to surfaces. Serves as a splicing tape to join specially siliconised surfaces like silicone release films, foils or papers. High or low temperature gasket sealing. PRODUCT BENEFITS Differential adhesive formulations. The acrylic adhesive provides an immediate high bond to high surface energy materials. The silicone adhesive a permanent one to silicone and siliconised substrates. Excellent chemical resistance.

Kapton® and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton® polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton® Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board

During printing and coating processes, so-called ink mist or particle mist arise in the outlet of doubleroll systems. This unwanted particle deposit results in lower product quality, high maintenance costs, increased ink consumption and the contamination of the environment. The formation of ink mist is very noticeable and annoying, particularly during coating and printing processes on substrates with non-absorbent surfaces (films, metalized substrates or composite films). A patented double-row DC plasma electrode is used to prevent this ink mist. This plasma electrode acts separately on both particle streams and ensures an optimal particle deposit. The electrode will be connected to the high voltage generator HSG61. The MISTING TACKER system is currently used for printing on metalized films and in silicone coating units (Wifag-Polytype).

During printing and coating processes, so-called ink mist or particle mist arise in the outlet of doubleroll systems. This unwanted particle deposit results in lower product quality, high maintenance costs, increased ink consumption and the contamination of the environment. The formation of ink mist is very noticeable and annoying, particularly during coating and printing processes on substrates with non-absorbent surfaces (films, metalized substrates or composite films). A patented double-row DC plasma electrode is used to prevent this ink mist. This plasma electrode acts separately on both particle streams and ensures an optimal particle deposit. The electrode will be connected to the high voltage generator HSG61. The MISTING TACKER system is currently used for printing on metalized films and in silicone coating units (Wifag-Polytype).

*Bopp Film Clear, metalised, Opaque Thickness: Between 15-50 micron *PET Film Silicone coated and uncoated *CPP, OPP, PP, PE *MET PET, PET/ALU/PE