Profiles thermal - Import export

Door and window systems with a thermal barrier MB-70HI, MB-70US HI and a curtain wall based on the MB-70CW HI windows. Their construction is based on well-proven, well developed and highly appreciated base systems, i.e. MB-70, MB-70US i MB-70CW. Enhanced thermal insulation performance is achieved due to placing special insulating inserts in the central insulating chamber, formed by connecting aluminium profiles with thermal breaks. Thus formed inserts reduce heat transfer through this chamber due to low value of heat transfer coefficient. The central location of inserts additionally limits convection and thermal radiation.

Developed within the Intel® Embedded Building Blocks Initiative A modular Embedded PC platform based on COM Express Suitable for: Individual Embedded systems (Integration in devices / equipments) Embedded PCsIndustrial PCs / BoxPCs Panel-PCs Display systems / Digital Signage Embedded PC - as easy as a standard PC Key functionalities Modular concept Scalable (from Intel ®Atom ™ bis Intel ®Core ™ i7) Space-saving through slim profile Optimal thermal connection and simple system integration Mainly passive cooling Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany" Realisation of hardware kits, Box-PCs and Panel-PCs/HMI Now also available with Intel Core 3 rd generation ("Ivy Bridge")!