Results for
BERATRONIC GMBH
Germany
Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Maintaining a dust-free environment is one of our top priorities, as it eliminates the possibility of any errors that may occur during the printing process.
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Hot Air Solder Leveling
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Our advanced systems ensure a continuous electronic exchange of information with customers over the INTERNET. Thanks to the GENESIS 2000 software, the technical information from the customers is converted into production patterns accurately and quickly, and the films are produced with printers to be used in the production stages.
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Laser cut stainless steel sieve, phosphorus-bronze, adhesive sieve Plate thicknesses: 80μ, 100μ, 120μ, 150μ, 200μ
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Electric Test
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Due to the fact that punching and cutting processes are performed with molds in single-sided printed circuit board production, our company has established its own mold production facility. Printed circuit information from customers is converted into a format suitable for mold production machines in the CAD/CAM work preparation center and transmitted to the mold center via the local computer network. In this center, necessary mold drawings are made using this information, and molds are produced quickly and precisely on state-of-the-art machines.
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Organic Surface Coating, which is one of the latest technologies among the surface treatment alternatives offered to the customer, ensures that all elements can be soldered well and a flat surface is obtained for proper adhesion of SMD elements to the printed circuit.
Request for a quoteSUPPLYIZI MATTRESS COVER PILLOW MEMORY FOAM LINEN BED
Turkey
Chemical Etching
Request for a quoteXIAMEN NINESUN IMP. & EXP. CO., LTD
China
Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid
Request for a quoteDISTRIBUCIONES JULMARSA S.L.
Spain
BASED ON POLYIMIDE FILM COATED WITH A SPECIAL SURFACE CONDUCTIVE ADHESIVE. STATIC GENERATION DURING ROLL UNWIND AND TAPE APPLICATION IS ELIMINATED. IT CAN WITHSTAND WAVE SOLDER TEMPERATURES UP TO 300C AND LEAVES NO ADHESIVE RESIDUE ON PRINTED CIRCUIT BOARDS UPON REMOVAL.
Request for a quoteSHENZHEN PROMOSTAR HARDWARE CO.,LTD
Germany
Electroplating, also known as electrochemical deposition or electrodeposition, is a process that involves coating a solid substrate with a thin layer of metal through the reduction of metal cations using direct electric current.Electroplating is widely used in industry and decorative arts to enhance surface qualities such as abrasion resistance, corrosion resistance, reflectivity, and appearance. It's used to build up thickness on undersized or worn-out parts (electroforming) In electronics, it deposits copper for printed circuit boards and interconnects in integrated circuits. Electroplating can also purify metals like copper.
Request for a quoteXIAMEN NINESUN IMP. & EXP. CO., LTD
China
Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month
Request for a quoteXIAMEN NINESUN IMP. & EXP. CO., LTD
China
Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen
Request for a quoteBERATRONIC GMBH
Germany
Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times
Request for a quoteTHERMA THERMOFÜHLER GMBH
Germany
Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and • spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.
Request for a quoteTHERMA THERMOFÜHLER GMBH
Germany
Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple material and spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.
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CRYOSNOW GMBH
Germany
• Optimum handling by compact design • Very low consumption • For difficult to access operations • Small and powerful • No power supply necessary, as driven pneumatically • Maintenance-free • For cleaning injection molds, devices, small components, printed circuit boards, ...
Request for a quoteDYMAX EUROPE GMBH
Germany
Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible
Request for a quoteTEPROSA GMBH
Germany
Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).
Request for a quoteSAMSYS GMBH
Germany
The Gecko Gripper (SP) enables the use of the innovative Gecko adhesive gripper technology in applications with a small surface area. Such areas which could not be automated so far. The gecko-inspired adhesive technology offers precise, track-free gripping. Even with porous workpieces this technology works. For example printed circuit boards or glossy surfaces. Cleaning is not necessary. The three different Gecko Single Pad Grippers (SP1, SP3 and SP5) are named after their payload in kilograms. Of course, the Gecko grippers can be used with leading lightweight robots and cobots. The compact single-pad design allows easy access to the workpiece, even in tight spaces. Since no electronics or air supply is required, the Gecko SP is a cost-effective plug-and-play solution. The Gecko gripper leaves no marks on glass. This eliminates the need for manual cleaning. This means a higher RoI and lower operating costs.
Request for a quoteTEPROSA GMBH
Germany
In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical
Request for a quoteTEPROSA GMBH
Germany
We are specialist in strain gage strain measurements on printed circuit boards and all other components. We carry out the application of strain gages and determine for you the actual stresses that occur, or the strain (also strain-rate) on a specific or several components in the manufacturing or assembly process. We perform our DMS measurements with certified measurement technology and according to the specifications of IPC/JEDEC-9704A. Expert advice from TEPROSA When measuring strain, in addition to many factors such as the appropriate measurement technology, it is also important to rperform the strain measurement correctly and to ensure that the sensors record the forces correctly. To ensure that the deformation of an object is correctly determined, it is therefore crucial to select the right strain gauges (also known as measuring strips) and to place them in the correct position on the measured object.
Request for a quoteVERPET S.R.O.
Czech Rep.
Preparatory, finishing and other required operations are carried out using bench drills and grinders and other small tools. For example, we provide winding of electric motor components. Polishing and polishing of workpieces. soldering of printed circuit boards, soldering, welding
Request for a quoteDR.-ING. MAX SCHLÖTTER GMBH & CO. KG.
Germany
The smallest electronic components, such as chips or connectors, present special challenges for electroplating coatings. In addition to the conductor pattern construction in the manufacturing of printed circuit boards, copper processes are used for filling blind microvias (blind holes) and metallizing through holes. Good metal distribution is necessary even with unfavorable geometry. The most important application areas are found in the automotive industry, telecommunications, and consumer goods industry, but also in the field of e-mobility.
Request for a quoteROVIMEX BATTERY AND ENERGY TECHNOLOGIES
Turkey
100% ozone friendly solvent - meaning zero ODP. Excellent removal of greases, oils and flux residues and acrylic protective coatings from printed circuit boards (PCBs) Leaves a perfectly clean, dry surface – traditional solvents often leave it greasy. It is harmless to most plastics, rubbers, elastomers and surface coatings. NDD is compatible with a wide range of plastics.
Request for a quoteXIAMEN INNOVACERA ADVANCED MATERIALS CO., LTD
China
DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm 2.
Request for a quoteOEN CHEMICALS GMBH
Austria
Sodium Persulfate is an inorganic compound. It is a very useful chemical compound which is made by the electrolytic oxidation of sodium hydrogen sulfate. Its chemical formula is Na2S2O8. Chemical Appearance Sodium Persulfate has the appearance of a white crystalline solid. It is almost non hygroscopic. Chemical Applications and Strengths Sodium Persulfate is an extremely useful chemical compound and therefore, has many industrial applications. Its main applications and strengths are: Sodium Persulfate is most commonly used as a radical initiator for emulsion polymerisation reactions for styrene based polymers such as acrylonitrile butadiene styrene. It is used for fast paced curing of low formaldehyde adhesives. Sodium Persulfate itself is a bleach specifically in hair cosmetics and as a detergent component. It is used as a replacement of ammonium persulfate in etching mixtures for zinc and printed circuit boards.
Request for a quoteDR.-ING. MAX SCHLÖTTER GMBH & CO. KG.
Germany
Schlötter Systems Dr.-Ing. Max Schlötter GmbH & Co. KG is among the leading manufacturers of electroplating systems and surface treatment facilities. With more than 1,000 systems realized since 1957, we draw upon a wealth of experience in production-ready solutions. At Schlötter, we leverage our expertise in systems engineering and surface technology to precisely tailor each system to the coating processes required by our clients. We design and manufacture rack, barrel, and manual systems, modernize facilities, and support our customers with our systems technology services throughout the long lifespan of our systems. Rack systems Barrel systems Manual systems Electroplating systems Anodizing systems Cleaning and pickling systems Chemical systems Printed circuit board systems Plastic electroplating systems Schlötter Systems in All Surface Technology Industries Schlötter systems are utilized for a wide range of surface technology applications.
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