Printed circuit board transformers - Import export

The linear transducer model PWA measures the absolute position of the plunger without contact or wear using an inductive resonator measuring system. This consists of an excitation coil which causes an oscillating resonance circuit (moving target) fastened to the plunger to oscillate. This in turn excites the receiver coils fixed in the housing, which are printed on a printed circuit board. The integrated electronics transform these signals (sin/cos) into a signal proportionate to the linear travel. The measuring system is insensitive to electrical and magnetic fields. 0(4) to 20 mA and 0 to 10 VDC are available as standard as analogue signal outputs. CANopen, IO link and SSI are in preparation. The sensor is fastened using at least two retaining clips HK-01 or using sliding blocks ST-01. The sensor can be equipped with ball joints at the front and rear. Alternatively, the sensor's plunger can be designed as a button.

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times