Pcb assembly - Import export

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

SPIROL's Series 880 Coiled Spring Pin was designed specifically for use as the hinge pin for PC board card lock and ejector clip mechanisms. The quality of the hinge is unsurpassed by other fastening methods due to the low insertion force and compression of the pin during and after installation. As with all Coiled Spring Pins, the Series 880 hinge pin for PC board card locks and ejector clips is self-retaining, and thus no secondary processes are required for retention. The Coiled Pin's uniform radial spring force results in a controlled hinge movement that remains consistent throughout the life of the assembly.

EE Proto provides final assembly services for customers who prefer to receive completed PCB into final packaging.

Printed circuit board design services is one of the ways that we help our customers get to market faster as our engineering team has significant real world experience designing PCBs for performance and manufacturability.

EE Proto utilizes 3D Printing to enable companies, inventors, makers, engineers to launch new products to market in a much easier, faster and affordable way.

Every service we provide is driven by our motto “Launch your project as simple as 1 2 3”, EE Proto is providing one stop solutions for customers interested in prototyping->mid-scale production. One of the most important advantaged of EE Proto is that we produce each product with the same seriousity and quality even for 1 prototype.

Pattern Coating

Blue Chip Technology have an in-house team of dedicated engineers with a wealth of expertise and experience in designing boards for a variety of applications and industries. We excel in compact PCB designs that allow you to incorporate the necessary features into your product.

From component preparation to precise soldering and checking: our THT assembly Our skilled employees take care of the manual component preparation on site so that the component later fits perfectly on the circuit board. We also have our own parts warehouse, with which we ensure reliable production of your THT orders. The THT assembly area at A + B Electronic includes three selective soldering systems and two wave soldering systems. Depending on the equipment, the right soldering process is selected. With the Ersa VERSAFLOW 4/55 selective soldering machine, we also have a system of the latest product generation. What speaks for us: -Contact person for prototypes, large or small series -A high mix of components is not a problem -We test the technical feasibility of your project before each order -We are not just a service provider, but a technology partner: A+B Electronic thinks through your project with you and together we can bring it to successful series production

Suitable for every order size: SMD assembly is one of our core competencies Our SMD assembly is characterized by modern production standards and a low error rate. Stencil printers and a jet printer are available in front of our three production lines. This means that we are as flexible as possible when preparing your project. The SMD components are precisely applied in our pick and place machines and soldered in reflow ovens, or in special cases also in our vapor phase. A highlight: We have a hybrid assembly machine, the FUJI 7x NXT2. This is our way to work with the greatest precision, quickly and safely. What speaks for us: -Your Contact person for prototypes, large or small series -A high mix of components is not a problem -We test the technical feasibility of your project before each order -We are not just a service provider, but a technology partner: A+B Electronic thinks through your project with you and together we can bring it to successful series production

In the area of PCB assembly, KUK Group offers SMD and THT assembly lines, where we manufacture according to the customers' requirements. For quality inspection, we use automated optical inspection systems (AOI), an X-ray machine and manual optical inspection. KUK Group assembles printed circuit boards that are used in a wide variety of applications. As a purely customer-specific manufacturing partner, we also provide our well-known individual and high-quality service in PCB assembly, gladly also for small series. KUK thus offers you electronics from a single source in addition to winding goods. On our fully automatic surface mount device lines (SMD), we take care of the PCB assembly for you. Various soldering systems round off our range in the area of SMD PCB assembly. -Rigid, flexible circuit boards -Aluminum circuit boards -Component size starting at 0201 -Fine pitch -Lead-free -Double sided SMD, THT assembly -Mixed THT, SMD assembly -Tracked assembly

SMT and THT assembly with automatic lines. IPC Class 1-2-3 products.

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

Bondable platinum 1000 Ohm RTD component Nominal resistance 1000 Ω at 0 °C Operating temperature range —50 °C to +150 °C TCR Pt 3850 ppm/K Chip size/dimensions 0.75 x 0.75 x 0.3 mm Tolerance/class IEC 60751 F0.3 (IST AG tolerance class B) Connection type Bondable pads (Au) Packaging Chip tray, sensor-side up

IST AG offers wireless RTD Platinum SMD sensors for automatic PCB assembly processes with wrap-around contacts on both ends. We offer different SMD technologies for different applications and temperature ranges, e.g. SAC305-tinned wrap-around contacts for the normal PCB assembly process, high temperature solder wrap-around contacts for high temperature applications up to +250 °C or Ni/Au wrap-around contacts for special requirements or wire bonding applications. The SMD sensors are available with various accuracies of up to IEC 60751 F0.15 (IST AG reference class A) and in different dimensions (0805/1206) with other dimensions upon request. SMD sensors are characterized by excellent long-term stability, fast response time and low self-heating.

The wireless IST AG FlipChip series features Pt temperature sensors with excellent long-term stability, fast response time and low self-heating. The FlipChips are developed with contacts on one side resulting in no short-cut risk on the backside of the chip. Furthermore, IST AG offers different FC technologies for different assembly processes (reflow-soldering, bonding or welding). The FC sensors are available with accuracies of up to IEC 60751 F0.3 (IST AG reference class B) and in different dimensions (0603/0805/1206/further dimensions on request) with other dimensions available on request. The FC sensors are optimal for applications with limited space requirements and offer an optimal price/performance ratio. Due to the small mechanical dimensions, a standard 0805 FC will use the same space as a standard 0603 SMD sensor on a PCB.​

We offer a large standard assortment of high-quality tactile short-stroke switches or micro switches and micro switches. The switches and pushbuttons are characterised by a high level of workmanship and a long service life (up to 1 million cycles). The microswitches are used in medical technology, industry, entertainment technology and in the automotive sector and are suitable for PCB assembly. They are supplied on a roll. If your desired specification is not available in our standard range, please feel free to contact us at any time. Completely customised developments are also possible.

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for machine assembly (Pick & Place) of Fine-Pitch QFP 256 QFP 256 4 x Size 100 x 140 mm

Contract Manufacturing by SEACOMP Get your concept to physical product with our electronics manufacturing services. Use our engineering team to get your design ready for mass production or let us take your perfectly designed product and build it at scale. We help launch electronic devices for home automation, industrial controls, consumer products, and medical devices. Manufacturing is completed in our wholly-owned China facility that is ISO 13485 certified. Our production capabilities include: - PCB Assembly, Surface Mount (SMT), Through Hole Assembly - Wave Soldering - Reflow Soldering - Plastic Injection Molding (vertical and horizontal) - Ultrasonic Welding - Cable Assembly and Over-Molding We also provide the finished assembly of your product before it is shipped anywhere in the world: - Laser Marking - Pad Printing - UV Ink Curing - Label Printing - UV Light Metering - Box Build Assembly - Bulk or Retail Packaging - Warehousing Contact us to learn more.

Metal stamping parts are widely used as metal casing/housing in which all electronics components and PCB board will be assembled, they are designed to be different shapes with various kinds of surface finish, metal material makes the whole light long durability and heat resistance compared to plastic parts, they can be formed by stamping, deep drawing, spinning or TIG welding.

Up to 60 rivets per minute! – Endorsed by major customers! GESIPA® speed rivets are a cost-effective alternative to automation. Speed rivet technology is a joining method that requires access from only one side and which enables fast cycle times thanks to the preloaded rivets and automatic feed. Advantages • Large grip range • Reduced variation • Optimum hole filling capabilities and bearing stress • Ideally suited for transferring shear strengths with moderate clamping force • Ideal for: — LED light strips — Electronic/pcb assembly — Lightweight sheet metal structures — PC housings — Rating plates — Blind holes

The AN2000C Signal Conditioner & Display is designed to process and display signals coming from various types of transducers (weight, load, pressure, torque, etc.) that use standard strain-gauge bridges. It can also receive any signal within the range ±300mVDC coming from a shunt, a converter or any type of transmitter. The Conditioner provides selectable input ranges (max. ±300mV) and excitation voltages (5V, 10V) to accommodate cells of various types and sensitivities. Two programming methods allow scaling of the meter to operate in the desired engineering units. The basic instrument consists of a PCB assembly including the main board, the display and the power supply filter, to which the A/D conversion circuit and the input option are added. The functions of the basic instrument include the display of the input variable as well as the remote freezing of the display (HOLD), the reading of the stored minimum and maximum values (PEAK & VALLEY) and the TARE function with RESET.

Exposed linear encoders are designed for use on machines and installations that require high accuracy of the measured value. Typical applications include: Measuring and production equipment in the semiconductor industry PCB assembly machines Ultra-precision machines High-accuracy machine tools Measuring machines and comparators, measuring microscopes, and other precision measuring devices Direct drives Our standard encoders are suitable for use in a low or medium vacuum. Encoders used for applications in a high or ultrahigh vacuum need to fulfill special requirements. Design and materials used have to be specially adapted for it. For more information, refer to the Technical Information document Linear Encoders for Vacuum Technology. The following exposed linear encoders are specially adapted for use in high and ultrahigh vacuum environments. • High vacuum: LIP 481 V and LIF 481 V • High vacuum: LIC 4113 V and LIC 4193 V • Ultrahigh vacuum: LIP 481 U

SMT & THT assembly, functional testing, conformal coating selective application, assembled PCBs automated printed circuits cleaning, programming and functional testing of electronic units, setting up and adjustment of electronic units, case assembly, PCB design.

PCB Assembling Shaping, cutting and assembling of components is done manually with bending jigs. For faster work it is recommended not to send bulk components. Tape/reel or taped/ammopack version is more convenient. This is, however, not a condition.

Application of soldering paste Done with metal stencils by screen printing machine VERSAPRINT or by manually controlled machine UNIPRINT Maximum size of printed pattern is 610mm x 510mm We use soldering paste from Kester company, other types only when requested

100% of assembled PCBs are under optical control. This control is carried out by FDL520 machine by MARANTZ company or by microscope and zooming tool. Many customers demand soldering and control according to IPC-A-610, therefore final optical control is done by 3D microscope. It is possible to clean assembled boards in automatic large-capacity Super-SWASH machine or in ultrasonic machine. Cleaning will eliminate flux residuals left on board after soldering. These residuals could affect the durability of the board. If the board is supposed to be lackered, cleaning is necessary.