Modular structures - Import export

Rugged IP65 and NEMA4 Aluminium Chassis, Fanelss design Front Panel IP65/NEMA4 Standard, water and dust proof Fanless and sealed enclosure Excellent touch accuracy High resolution and response speed; Capacitance up to 10 points touch; Click life exceeds 10 million times Mohs hardness 7H; Transmittance> 75 Neutral front panel Nodka offers neutral front panel design without logo in neutral packag, as well as customized logo printing Flexible modular design Product is with modular design structure, easy for maintenance and upgrade Different mounting options as requests

Rugged IP65 and NEMA4 Aluminium Chassis, Fanelss design Front Panel IP65/NEMA4 Standard, water and dust proof Fanless and sealed enclosure Excellent touch accuracy High resolution and response speed; Capacitance up to 10 points touch; Click life exceeds 10 million times Mohs hardness 7H; Transmittance> 75 Neutral front panel Nodka offers neutral front panel design without logo in neutral packag, as well as customized logo printing Flexible modular design Product is with modular design structure, easy for maintenance and upgrade Different mounting options as requests

Fanless Mini PC with Intel® Core™ 6/7/8/9th generation i3/i5/i7 Based on Intel® Core™ 6/7/8/9th generation i7 / i5 / i3 / Pentium®/ Celeron® , LGA1151，MAX TDP 65W Aluminum alloy box Integrated remote transmission sender module, up to 100 meters between PC to display/HMI 3x Intel i211 Gbe LAN controller 4x USB3.0, 2x RS-232/485 Option 1 x PCIe x16 slot or 1 x PCI slot I/O: DVI-D/3GLAN/4USB/e-LINK sender Port/2x RS-232/485/PCIe x16+1 PCI Support win7,Win7 Embedded,Win10,Linux Optimized for Industrial Applications Modular design structure,easy for maintenance and upgrade Wide Work Temperature, system operating temperature supports -20 up to +60°C Multi-network ports and serial port expansion