Thermal conductivity adhesive - Import export

By mounting an axial fan, the effectiveness of the new Kühligel® can be increased considerably. Fanless solutions require a lot of space. They are heavy and expensive. For cooling with active coolers by SEPA EUROPE however, the new Kühligels are not only small and light but also extremely inexpensive. Thanks to intensive development work, SEPA EUROPE was able to construct a heat sink that enables fan mounting without extensive reworking using conventional screws. The choice of the suitable fan (size, sleeve or ball bearings, 5, 12, or 24 VDC, tacho, connector) enables the best possible combination that is required for the application in question. The fans used have a MTBF of up to 350000h (40°C) and thus meet the highest requirements. Thanks to its light weight, the Kühligel® can usually be mounted using double-sided adhesive heat conduction pads (TCTxx) or thermally conductive two-component adhesive (Hernon 746) which are both available from the SEPA EUROPE product range.

Requirements for products working in a high temperature fusing environment include continuously increasing requests for longer part life, higher print speed, and better print resolution involving ongoing material and process innovations. Our goal is to find the best combination of the following properties: Thermal resistance Thermal conductivity Abrasion resistance Anti-adhesive surfaces Elastomer hardness Substitution of Metal Substrates by Polyimide Belts Fusing by heat and pressure in digital printers has previously been realized with anti-adhesive coatings on aluminum or steel cores. These metal substrates have been increasingly replaced by seamless thin walled polyimide belts due to energy-saving environmental regulations and the growing requirement for “instant on” printing devices. Image Fusing Products Fuser rollers with soft and thin coatings more Fuser rollers for professional digital printing more Pressure rollers with solid silicone/PFA sleeves more Pressure rolle

Form: Granule; Feature: Heat Insulation and Low Thermal Conductivity; Application: Extrusion & Injection Moulding; Customized: Yes and contact for material solution.

The thermal conductivity measuring insert is intended for measurement of the thermal conductivity coefficient temperature dependencies in constant magnetic field using stationary method. The inner sample holder is equipped with the resistive heaters, resistive temperature sensors and Hall sensor. The thermal conductivity measuring insert characteristics: - relative measurement accuracy of thermal conductivity coefficient: 3 %; - sample dimensions: a rectangular plate 22×4×2 mm; - temperature interval – from 80 to 370 K; - magnetic field interval – from 0.02 to 2 T.