Soldering circuit boards - Import export

Whether an individual circuit board or full-scale, demanding device assembly – PRUFREX will manufacture your products to your individual specifications and quality guidelines. Whether it's manual soldering with robotic support, wave and selective soldering or laser soldering – in all assembly tasks, we are able to use any technique required without a problem. Depending on the component, different soldering technologies offer different advantaged. We will adjust the process individually to your project.

Our production facilities are fully up to date. Thanks to the adjustable design of our lines, we can easily implement special solutions. We have the latest generation Rehm reflow soldering systems. In particular with regard to temperature zones, they are exceedingly efficient. The soldering process takes place in a protective atmosphere. In the reflow soldering process, we process through-hole and SMD components. The number of work stages, sources of error and thermal loads is reduced. In the reflow process we are also able to solder through-hole components, thereby reducing sources of error and repeated thermal load and work stages.

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC Eprom 32 (1.27 mm) Hole diameter 1.00 mm Size 22.94 x 38.11 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu - Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 20 (1.27 mm) Hole diameter 1.00 mm Size 22.86 x 22.94 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 18 (1.27 mm) Hole diameter 1.00 mm Size 22.80 x 22.94 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm) Hole diameter 1.00 mm Size 45.72 x 45.80 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 144, 160 (0.65 mm) and QFP 100, 132, 164 (0.635 mm) Hole diameter 1.00 mm Size 63.58 x 63.58 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 80,84 (0.65 mm) Hole diameter 1.00 mm Size 40.64 x 45.72 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 80 (0.80 mm) and QFP 100 (0.65 mm) Hole diameter 1.00 mm Size 45.80 x 50.80 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 32, 64 (0.80 mm) and QFP 64 (0.50 mm) Hole diameter 1.00 mm Size 38.10 x 45.80 mm

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and • spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple material and spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and spring-loaded sockets for reliable contact. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Preparatory, finishing and other required operations are carried out using bench drills and grinders and other small tools. For example, we provide winding of electric motor components. Polishing and polishing of workpieces. soldering of printed circuit boards, soldering, welding

Origin: China Model Number: JXPCBML1 Min. Hole Size: 0.2mm Board Size: Custom made Layer: 8 Layer Testing point: 3600 Minimum Annular ring: 4mil Minimum solder bridge: 0.08mm Solder mask color:  Green PCB Standard: IPC-II Standard Warp and Twist: 0.75% Certificate: ROSH. ISO9001. Application: Aerospace Recorder Number of Layers: 8-layer Base Material: FR-4 Copper Thickness: 1oz Board Thickness: 1.6mm Min. Line Width: 4mil Min. Line Spacing: 4mil Surface Finishing: Immersion Gold Supply Ability: 20000 Square Meter/Square Meters per Month