Printed circuit board - Import export

Maintaining a dust-free environment is one of our top priorities, as it eliminates the possibility of any errors that may occur during the printing process.

Hot Air Solder Leveling

Our advanced systems ensure a continuous electronic exchange of information with customers over the INTERNET. Thanks to the GENESIS 2000 software, the technical information from the customers is converted into production patterns accurately and quickly, and the films are produced with printers to be used in the production stages.

Laser cut stainless steel sieve, phosphorus-bronze, adhesive sieve Plate thicknesses: 80μ, 100μ, 120μ, 150μ, 200μ

Electric Test

Chemical Etching

Due to the fact that punching and cutting processes are performed with molds in single-sided printed circuit board production, our company has established its own mold production facility. Printed circuit information from customers is converted into a format suitable for mold production machines in the CAD/CAM work preparation center and transmitted to the mold center via the local computer network. In this center, necessary mold drawings are made using this information, and molds are produced quickly and precisely on state-of-the-art machines.

Organic Surface Coating, which is one of the latest technologies among the surface treatment alternatives offered to the customer, ensures that all elements can be soldered well and a flat surface is obtained for proper adhesion of SMD elements to the printed circuit.

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

Electroplating, also known as electrochemical deposition or electrodeposition, is a process that involves coating a solid substrate with a thin layer of metal through the reduction of metal cations using direct electric current.Electroplating is widely used in industry and decorative arts to enhance surface qualities such as abrasion resistance, corrosion resistance, reflectivity, and appearance. It's used to build up thickness on undersized or worn-out parts (electroforming) In electronics, it deposits copper for printed circuit boards and interconnects in integrated circuits. Electroplating can also purify metals like copper.

Place of Origin: China Base Material: FR-4 Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.8mm Min. Hole Size: 0.1mm Min. Line Width: 0.065mm Min. Line Spacing: 0.065mm Surface Finishing: HASL Application: Electronics Device Type: Customizable Solder mask: Black Material: FR4 CEM1 CEM3 height TG Color: Red Blue Green Black Testing Service: 100% Supply Ability: 25000 Square Meter/Square Meters per Month

Origin: China Model Number: JXFPC Min. Hole Size: 0.20mm Materials: PI/PET Type: FPC Layers: 1-6 Finished surface: OSP/ENIG Board thickness: 0.2mm Solder mask color: orange Certificate: ISO9001 Copper weight: 1 OZ Base Material: PI/PET Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Board Thickness: 0.20mm Min. Line Width: 0.1mm/4mil Min. Line Spacing: 0.1mm/4mil Surface Finishing: OSP/ENIG Supply Ability: 3000 Square Meter/Square Meters per Month Packaging Details: packing with anti-static red/white bubble Port: Xiamen

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and • spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple material and spring-loaded sockets for reliable contact. • Moulded barriers prevent short-circuits. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

Use: Miniature Jack/Socket for thermocouple and RTD circuits. Designed for direct soldering onto printed circuit boards. This version is suitable for flat mounting other versions available, please see separate specification sheet. Mechanical design: • Housing of fibreglass-filled plastic. • Contacts of original thermocouple materials and spring-loaded sockets for reliable contact. • Reverse polarity protection by different contact pin widths. • One-piece housing withstands great stresses.

• Optimum handling by compact design • Very low consumption • For difficult to access operations • Small and powerful • No power supply necessary, as driven pneumatically • Maintenance-free • For cleaning injection molds, devices, small components, printed circuit boards, ...

Dymax Dual-Cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Features: - Cures with UV/Visible light - Dual Cure secondary moisture cure capability - Fluoresces blue under black lights - Flexible

The Gecko Gripper (SP) enables the use of the innovative Gecko adhesive gripper technology in applications with a small surface area. Such areas which could not be automated so far. The gecko-inspired adhesive technology offers precise, track-free gripping. Even with porous workpieces this technology works. For example printed circuit boards or glossy surfaces. Cleaning is not necessary. The three different Gecko Single Pad Grippers (SP1, SP3 and SP5) are named after their payload in kilograms. Of course, the Gecko grippers can be used with leading lightweight robots and cobots. The compact single-pad design allows easy access to the workpiece, even in tight spaces. Since no electronics or air supply is required, the Gecko SP is a cost-effective plug-and-play solution. The Gecko gripper leaves no marks on glass. This eliminates the need for manual cleaning. This means a higher RoI and lower operating costs.

In an environmental simulation, assemblies are subjected to defined environmental conditions to validate their behavior under those conditions. The variables of an environmental simulation test include climatic aspects such as temperature (cold, heat), the air conditions (humidity, wetness), mechanical influences such as dust, vibration, vibration or impacts, and corrosive environmental effects such as salty lift (salt fog). As an environmental simulation laboratory, we simulate these environmental conditions in our climatic chambers and climatic chambers, creating real conditions to investigate the long-term behavior of the test specimens in reality. Environmental simulation and thermal shock testing laboratory for electronic assemblies and printed circuit boards We specialize in performing environmental simulation and temperature shock testing of electronic and mechanical assemblies. With over ten years of experience with the requirements of the automotive industry and medical

We are specialist in strain gage strain measurements on printed circuit boards and all other components. We carry out the application of strain gages and determine for you the actual stresses that occur, or the strain (also strain-rate) on a specific or several components in the manufacturing or assembly process. We perform our DMS measurements with certified measurement technology and according to the specifications of IPC/JEDEC-9704A. Expert advice from TEPROSA When measuring strain, in addition to many factors such as the appropriate measurement technology, it is also important to rperform the strain measurement correctly and to ensure that the sensors record the forces correctly. To ensure that the deformation of an object is correctly determined, it is therefore crucial to select the right strain gauges (also known as measuring strips) and to place them in the correct position on the measured object.

Preparatory, finishing and other required operations are carried out using bench drills and grinders and other small tools. For example, we provide winding of electric motor components. Polishing and polishing of workpieces. soldering of printed circuit boards, soldering, welding

The smallest electronic components, such as chips or connectors, present special challenges for electroplating coatings. In addition to the conductor pattern construction in the manufacturing of printed circuit boards, copper processes are used for filling blind microvias (blind holes) and metallizing through holes. Good metal distribution is necessary even with unfavorable geometry. The most important application areas are found in the automotive industry, telecommunications, and consumer goods industry, but also in the field of e-mobility.

100% ozone friendly solvent - meaning zero ODP. Excellent removal of greases, oils and flux residues and acrylic protective coatings from printed circuit boards (PCBs) Leaves a perfectly clean, dry surface – traditional solvents often leave it greasy. It is harmless to most plastics, rubbers, elastomers and surface coatings. NDD is compatible with a wide range of plastics.

Ammonium Persulfate has the appearance of a white crystalline solid. It is highly soluble in water. Chemical Applications and Strengths Ammonium Persulfate is an extremely useful chemical compound and therefore, has many industrial applications. Its main applications and strengths are: Ammonium Persulfate is most commonly used as an oxidising agent and a source of radicals. It is a strong oxidising agent that is used in polymer chemistry as an etchant. It is used as a cleaning and bleaching agent. It is used as a radical initiator in the polymerisation of specific alkenes. Important polymers prepared with this include styrene butadiene rubber and polytetrafluoroethylene. Because of its strong oxidising properties it is used to etch copper on printed circuit boards as a ferric chloride solution alternative.

Sodium Persulfate is an inorganic compound. It is a very useful chemical compound which is made by the electrolytic oxidation of sodium hydrogen sulfate. Its chemical formula is Na2S2O8. Chemical Appearance Sodium Persulfate has the appearance of a white crystalline solid. It is almost non hygroscopic. Chemical Applications and Strengths Sodium Persulfate is an extremely useful chemical compound and therefore, has many industrial applications. Its main applications and strengths are: Sodium Persulfate is most commonly used as a radical initiator for emulsion polymerisation reactions for styrene based polymers such as acrylonitrile butadiene styrene. It is used for fast paced curing of low formaldehyde adhesives. Sodium Persulfate itself is a bleach specifically in hair cosmetics and as a detergent component. It is used as a replacement of ammonium persulfate in etching mixtures for zinc and printed circuit boards.

DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm 2.

Schlötter Systems Dr.-Ing. Max Schlötter GmbH & Co. KG is among the leading manufacturers of electroplating systems and surface treatment facilities. With more than 1,000 systems realized since 1957, we draw upon a wealth of experience in production-ready solutions. At Schlötter, we leverage our expertise in systems engineering and surface technology to precisely tailor each system to the coating processes required by our clients. We design and manufacture rack, barrel, and manual systems, modernize facilities, and support our customers with our systems technology services throughout the long lifespan of our systems. Rack systems Barrel systems Manual systems Electroplating systems Anodizing systems Cleaning and pickling systems Chemical systems Printed circuit board systems Plastic electroplating systems Schlötter Systems in All Surface Technology Industries Schlötter systems are utilized for a wide range of surface technology applications.

Advanced inverter technology for superior TIG DC performance. Industrial TIG welder for difficult conditions. The fully functional and user-friendly control panel, with graphical and numeric display, makes it easy to set all welding parameters. Robust construction: electrical safety (IP23S), protected printed circuit boards and optimal airflow reduce contamination to extend equipment life in the harshest environmental conditions. TIG HF and Lift ignition meets all requirements. Perfect start of the TIG HF with pre-defined start mode. Complete configuration of TIG parameters: Pulse TIG with variable frequency that allows the welder to adjust the arc focus according to applications, 10 memory positions for personalized welding settings, TIG spot welding. Water coolers and carts available What's included: Input cable (2m) Gas connection kit

• Most popular shape for assembly work, trimming printed circuit boards, also for radio and telephone work • For gripping small parts and forming wires • Tips bent 45°, smooth inside jaws, edges rounded • Tight-fit joint movement • With box-joint and opening spring • Handles with ergonomically shaped ESD multi-component sleeves, electrically conductive • Made of tool steel, forged, oil-hardened