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The ProMapper is the A&R table-top solution to provide state-of-the-art optical inspection according to the industry standards (ISO/ANSI), totally independent from the operator. In addition, it supplies freeform surface evaluation based on the A&R Error Map technology, making sure that no surface defect is shipped to the customer. Based on the Error Map, surface quality features like the GMC (Global Mapping Criteria) are evaluated and constitute extremely relevant inspection data for process control applications (Statistical Process Control).
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The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.
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