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Microelectronic circuits continuously require new packaging technologies. Ceramic substrates are widely used in this field for their good dimension stability, high electrical insulation as well as their resistance to high temperature. But it is now possible to create microelectronic circuits on 3D carriers made with ceramics. This new type of component integrates electrical and mechanical functions on a same carrier, which gives a wider scope in terms of design and integration. Microcertec has developped a unique expertise to manufacture these ceramic 3D interconnection devices - CI3D - based upon high-precision ceramic grinding of a 3D carrier, thin-film metallizing and laser etching. These 3D interconnect carriers demonstrate the advantages of being made with advanced ceramics but they also offer miniaturization capabilities, enhanced reliability and more simple integration stages. In actual fact, the geometry of the carriers offers a 3D arrangement so that microelectronic...
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With its fast and innovative 98-laser-line mode, the FreeScan Trio is SHINING 3D's first marker-free laser 3D scanner. Less preparation, more efficiency. The FreeScan Trio's three additional laser scanning modes deliver unrelenting accuracy, each reaching up to 0.02mm with markers. This metrology device also features built-in photogrammetry to offer an impressive volumetric accuracy of up to 0.02mm + 0.15mm/m. Whether you need speed or accuracy on small or large assemblies, the versatile FreeScan Trio is geared for all your projects.
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