Electric point - Import export

IMS (Insulated metal substrate) technology allows the mounting of power components directly on a highly thermally conductive printed circuit board . The result is a compact and reliable solution which, thanks also to the reduced cost compared to systems with traditional heat sinks, is finding more and more application in sectors where effective dissipation of the heat generated by electronic components is required, such as of Lighting, Automotive and Power Supply . The devices can operate at lower temperatures with a guarantee of greater reliability and lifespan , avoiding the assembly phases of mechanical heat sinks. The assembly cycle is simplified and can in some cases be reduced to just the SMT assembly operation. The availability of dielectric layers of different nature and thickness offers many design possibilities from a thermal and electrical insulation point of view. It is possible to use different materials with both aluminum and

RC-SPC1K is an thick film technology rain sensor. This device is realized in Allumina (AL2O3) substrate, this material is endowed a big reliability from an electrical thermal point of view. The sensor consists of three parts : 1) Capacitive sensor (Face A) 2) Heater generator 3) Temperature Sensor The Face A is the sensitivity area (capacitiver sensor) this area is exposted to natural agent (rain); In dry condition the value of the capacitor is nominal 100pF, In presence of the rain the capacitance goes to high valued respect the dry contidion; The ratio changing is over 420%, in the table N.1 you can verify the capacitance change characteristics. On Face B is present the heating circuit the temperature sensor (NTC component) and the connection interface (six pads).