Glass wafer - Import export

The company is technologically capable of slicing of thin wafers from optical glass and semi-precious stones.

With the RobotOverhead-Gripper it is possible to lift sensitive materials contactless from above by means of a robot. Besides from gripping, it can be used for (un)loading, sorting and singulating. The RobotOverhead-Gripper uses a combination of negative pressure and the Ultrasonic Suspension Technology to enable topside gripping of the workpiece. The substrate is kept at a distance, which enables contactless transport and prevents micro-scratches and contamination. Our technology allows a high flatness of the substrate during the handling process. The RobotOverhead-Gripper is suitable for battery cells, glasses, foils, lenses, packaging, wafers and other sensitive materials. It can be supplied in various versions, for example for the contactless transport of glass components in the manufacture of flat screens. Features of the RobotOverhead-Gripper: - Contactless topside gripping - High flatness of the substrate - Different dimensions - Safety hooks can be fitted as an option