Printed circuit board - Import export

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

Our services •Layout creation •Material procurement •SMD assembly •Manual and semi-automatic •Mounting •Reflow and wave soldering •Selective soldering •Automatic Optical Inspection (AOI) •X-ray inspection •System assemblies •In circuit tests and •Function test •Revision and repair •Rework Station •Short delivery times

Certain plastic encapsulated surface mount devices (SMDs), if not handled properly, can incur damage during the solder reflow attachment process to printed circuit boards (PCBs). In order to prevent damages, the moisture sensitive product is typically baked before packing. After baking, the product is placed inside a DryPack bag along with predetermined amount of desiccant and a humidity sensitive indicator card (refer to JEDEC JSTD033C). The vacuum sealed bag is labeled and placed in a pizza box carton.

SELECTIO Selective soldering systems for automatic single point soldering and multiple point soldering It is not always possible to use mass soldering processes such as wave soldering to perform a certain soldering task. Individual soldering steps are often necessary. To automate this process and to lower the costs while maintaining the high quality requirements, STRECKFUSS SYSTEMS has developed the selective soldering system SELECTIO. Just like our wave soldering system TITANIUM, SELECTIO too is equipped with the corrosion and tin resistant agent titanium and therefore works perfectly for lead free soldering. Product characteristics – an overview: x/y/z- axes system with precision toothed drive belt transport system and assembly carrier standard stand- alone- system (offline system): optional transportation belt connection as inline system printed circuit board transportation with assembly carrier soldering processes: single point nozzle and surface nozzle as well as dip soldering via mask technique fluxing out of vendor's flux container with multi- drop- fluxer nozzle short wave IR- quartz- radiators for preheating of printed circuit boards pyrometer for contact- free temperature check of printed circuit boards easily exchangeable soldering nozzles Microsoft© Windows user surface and process visualization: - BDE for documentation complying with DIN ISO 9000 ff - management data organization - optional real- time video surveillance

TYP C 044/S Cutting, stamping and bending device for axial components Description To facilitate the placement of short axial leaded components that must be cut before insertion into the circuit board to the appropriate length and bent to the required height and - if necessary - marked . This axial taped components are processed in high- components. In the device 044 C / S to be bent, the components are manually inserted into the device and processed by triggering the pneumatic foot switch. The high- axial component can be provided either at one or at both terminal wires with a bead for preventing falling out of the printed circuit board according to the manual setting operation. Components