French fries - Import export

Get a higher level of automation and increased efficiency, without compromising quality and precision. Our affordable and proven solutions, ranging from encapsulation, testing and encoding of chip modules to glue tape lamination, provide the speed, quality and economy for profitable chip module production. RFID Inlay Production Wire embedded antennas produced on ruhlamat machines are extremely cheap and yet provide the best product characteristics compared to etched or plated antennas. Our reliable machine solutions offer great flexibility and productivity, enabling you to make both prototypes and mass products in an economical way and with consistently high quality. From antenna embedding to production of complete RFID inlays and eCovers, the options are versatile. Card Personalisation We excel in providing innovative card personalisation solutions. Our system enables you to produce highly personalised smart cards, secure IDs, and financial cards quickly and economically. We...

Encapsulation is the method for protecting the chip and wires against mechanical stress and environmental influences. For this purpose, cast resin is dispensed and then cured by UV light or heat, depending on the type of resin. The PowerSeal offers highest quality and maximum speed for the encapsulation of chip modules with up to 40,000 modules/hour. PowerTest - Chip Module Test System The inspection of IC modules for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance. The PowerTest is designed for high-speed testing and encoding of chip modules on 35 mm tapes. The system is also perfectly suited for initialisation and personalisation of IC modules, including OS loading. GTL700 - Glue Tape Lamination System The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The very efficient system can...

The PowerSeal sets new benchmarks for high-speed encapsulation of chip modules: extremely compact and powerful, with a throughput of up to 40,000 modules/hour using two 16-fold dispensing heads and UV LED curing technology. UV LED curing saves production cost by lower energy consumption and long LED lifetime without aging. The curing is much faster compared to standard UV discharge lamps and the start-up time is reduced by providing full power directly after switching on. This enables high-speed production with significantly lower cost per module, resulting in an unsurpassed value for money. Alternatively, the machine can also be equipped with UV discharge lamps or heating units. Diverse nozzle plates are available for the different module tape pitches. Thermal curing resins such as black epoxy can be processed optionally. Reliable process stations and automated inline quality control ensure highest quality at a minimum of cost per module. High-speed chip module encapsulation...

The PowerTest is a sophisticated testing and encoding system for chip modules on 35 mm tapes. Maximum flexibility allows versatile use: It can be used by card manufacturers for the incoming inspection or encoding of chip module tapes, and with integrated disconnect station by module tape manufacturers as a quality measurement system for the inspection of outgoing goods. Testing of contact, contactless and Dual Interface IC modules can be executed with the highest performance and yield by processing of up to 128 modules in parallel. In addition to basic test and parameter test, software is also available for chip module initialisation, personalisation, and OS loading. Integration of SAM, HSM, or similar modules can be realised easily. Using high-end reader technology from Smartware or Micropross, this automatic IC module test handler offers unmatched performance for the complete production test of smart card and RFID modules. Flexible reel to reel system for high-speed test,...

Permanent fixation of a chip module is crucial for every smart card to meet the different demands of ID cards, banking cards, GSM /SIM cards, and dual interface cards. The GTL700 is a highly reliable and flexible solution for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The glue tape is laminated onto the backside of the module tape. To accommodate the chip, holes are punched into the glue tape prior to lamination. The system operates stand-alone or inline, and is suitable for a wide range of IC module tapes. Various punching and laminating tools are available, which can be exchanged with a few simple steps. Optional reel units allow use of an additional protection tape and separation of carrier tape. Highest yield, maximum machine uptime and short product changeover times lead to very low cost of ownership Up to 8,000 chip modules/hour High flexibility for all IC module types and sizes, including dual interface Adjustable...