Chip test - Import export

The PowerTest is a sophisticated testing and encoding system for chip modules on 35 mm tapes. Maximum flexibility allows versatile use: It can be used by card manufacturers for the incoming inspection or encoding of chip module tapes, and with integrated disconnect station by module tape manufacturers as a quality measurement system for the inspection of outgoing goods. Testing of contact, contactless and Dual Interface IC modules can be executed with the highest performance and yield by processing of up to 128 modules in parallel. In addition to basic test and parameter test, software is also available for chip module initialisation, personalisation, and OS loading. Integration of SAM, HSM, or similar modules can be realised easily. Using high-end reader technology from Smartware or Micropross, this automatic IC module test handler offers unmatched performance for the complete production test of smart card and RFID modules. Flexible reel to reel system for high-speed test,...

Encapsulation is the method for protecting the chip and wires against mechanical stress and environmental influences. For this purpose, cast resin is dispensed and then cured by UV light or heat, depending on the type of resin. The PowerSeal offers highest quality and maximum speed for the encapsulation of chip modules with up to 40,000 modules/hour. PowerTest - Chip Module Test System The inspection of IC modules for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance. The PowerTest is designed for high-speed testing and encoding of chip modules on 35 mm tapes. The system is also perfectly suited for initialisation and personalisation of IC modules, including OS loading. GTL700 - Glue Tape Lamination System The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The very efficient system can...