Thermal interface materials - Import export

Our thermal management and insulation products are far from being just interim solutions. The Thermal Interface Materials (TIM) from Seifert electronic GmbH ensure optimal thermal connection between heat sinks and the components to be cooled. As electronic assemblies become increasingly compact, even a tiny gap between individual components can disrupt the necessary heat dissipation. Air pockets between the heat sink and the component being cooled hinder the optimal thermal connection. Possible consequences include temperature overload, which can lead to overheating in the worst-case scenario. Thermal management and insulation products act as connectors between the heat sink and the electronic component being cooled. They fill every tiny gap between the heat sink and semiconductor with thermally conductive material. This ensures optimal thermal connection and prevents any heat buildup.

GEOCELL® foam glass aggregate is a high quality product made from post-consumer recycled glass. It meets the highest quality requirements and provides outstanding features, which has no other product in this variety. GEOCELL® is 100 % mineral and combines low density with a high compressive strength. In addition to its very good thermal and sound insulating properties, it is also resistant to moisture, fire, chemicals and aging - a true "all-rounder". This combination of positive properties is providing many advantages and making GEOCELL® suitable for different industries.