Wire processing - Import export

The WPC is an integrated solution to produce wires for switch cabinets: it marks them and crimps the corresponding wire end ferrule. The WPC loads an EPLAN or other CAE file and produces all wires within this list step by step. Cross-sections from 0.5 mm² to 2.5 mm² are supported. For each item in this list, the wire is cut to length sequentially with the help of the multi feeder Z+F EVOFEED® , the corresponding labels are printed and the correct ferrule is crimped to the wire with the UNIC-GV universal crimping machine. The thermal transfer printer (THM-MMP) is suitable for all markers and labels of the MultiMark family as well as for continuous material, fabric and polyester labels, heat shrink tubing or PLC labels. The operation of the individual steps is carried out manually, which allows the operator to route and connect the wires for the complete job in the switch cabinet wire by wire. Due to the high level of automation it is not necessary to change wires and ferrules.

State-of-the-art manufacturing techniques are used in our electrical workshop. The world-renowned and appreciated Z+F machines are used for wire processing. These assure a high quality standard of the final product and allow great time savings in the manufacturing process. Thereby we can offer our customers a good and fair price-performance ratio. Individual marking of wires is supported. UL approvals are also possible.

The cable feeder trolley represents an innovative solution for the efficient processing of cables with various cross-sections and quantities, especially in conjunction with the Wire Processing Center. With this additional trolley, cable processing is elevated to a new level. The trolley provides the ability to place up to six different cross-sections simultaneously, ensuring flexible and time-saving handling. Using the cable feeder trolley optimizes the entire cable processing process. The versatility of the trolley allows for efficient handling of different types of cables, be it in terms of cross-section or quantity. This helps streamline workflow and increase productivity.

Technical information The UNIC-G is an electropneumatic stripper-crimper. This machine allows a quick and reliable processing of Z+F ferrules on reel in the range of 0.5mm2 up to 2.5 mm2 (AWG 20 – 14) without changing the tools. UNIC-G and UNIC-GS are now available with a fivefold infeed, which allows an even more efficient wire processing. Multi standard ferrules on reel can be used universally.

Technical information The Z+F WireDancer is an unrolling aid for wires from cardboard packaging or coils from different manufacturers and is therefore an ideal accessory for any cable production. Unwinding devices are key players in streamlining material handling during cable assembly. Tailored to efficiently dispense cable reels, these devices contribute to heightened precision and productivity. Central output of the wires Unrolling kit „Coils“ enables processing of cable reels in loose form (coils) Integrated magnets ensure easy fixation in the cardboard box Connecting to any processing devices (manual, semi-automatic or fully automatic processing) Easy placement of the Z+F WireDancer in different carton sizes

Technical information The AM 02.1 is an electropneumatic modular stripper-crimper for rapid and reliable processing of loose uninsulated Z+F ferrules. The stripper-crimper may be adapted by using the corresponding tools for ferrules of cross-sections from 0.25mm2 to 2.5 mm2 (AWG 24 – 14) and crimping lengths from 5mm to 12 mm. Specification For definition of the required tools the correct specification of the processed ferrules as well as the processed wires are needed. Options: Quadrocrimp-tool The stripper-crimper can be equipped with a quadrocrimp-tool which creates 4-side quadratic crimp.

Technical information The AM 04 is an eletropneumatic modular stripper-crimper for rapid and reliable processing of loose insulated Z+F ferrules. The stripper-crimper may be adapted by using the corresponding tools for ferrules with cross-sections from 4mm2 to 10mm2 (AWG 12-8) and crimping lengths from 8mm to 18mm. Specification For exact definition of the requierd tools, the correct specification of the processed ferrules as well as the processed wires are needed. Option: Quadrocrimp-tool The stripper-crimper can be equipped with a quadrocrimp-tool, which creates a 4-side quadratic crimp.

Technical information The AM 04.1 is an electropneumatic, modular stripper-crimper for rapid and reliable processing of loose uninsulated Z+F ferrules. The stripper-crimper can be adapted by using the corresponding tools for ferrules of cross-sections from 4 up to 10 mm2 (AWG 12-8) and crimping lengths from 9mm to 18mm. Specification For definition of the required tools the correct specification of the processed ferrules as well as the processed wires are needed. Options: Quardrocrimp-tool The stripper-crimper can be equipped with a quadrocrimp-tool, which creates a 4-side quadratic crimp.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam PC atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam PC is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam DUO atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the atmospheric pressure plasma system PlasmaBeam Mini, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 3 - 5 mm, substrates can be treated locally with precision. In contrast to the Plasmabeam devices, the PlasmaBeam Mini is designed for laboratory use. The PlasmaBeam technology enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam DUO atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam QUATTRO atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam QUATTRO is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.

Plasma systems from Diener electronic have long since established themselves in a wide variety of industrial sectors. With the PlasmaBeam atmospheric pressure plasma system, you can rely on modern and future-proof plasma jet technology under atmospheric pressure. Due to the treatment width of 8 - 10 mm, substrates can be precisely treated locally. PlasmaBeam technology can be used for inline processes. With the help of robots, 2 or 3-dimensional surfaces can be treated. PlasmaBeam enables local surface cleaning without masking the rest of the surface. For example, cleaning before wire bonding and various processes in the electronics industry. Furthermore, the PlasmaBeam is suitable as a pre-treatment device for the following processes: Gluing, bonding, printing, laminating, soldering, welding, flocking. The following surfaces can be treated with PlasmaBeam: Plastics, rubber, metal, glass, ceramics, hybrid materials.