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RAFI ELTEC GMBH
Germany
RAFI Eltec has over 20 years of experience in the special technology chip-on-board. That gives us a profound understanding of processes and quality in the standard technologies and beyond. As a result, we meet your requirements for flexible and reliable implementation of technically sophisticated solutions. We even set new standards. CHIP-ON-BOARD TECHNOLOGIES • Chip-on-board bonding • Chip-on-chip bonding • Chip-on-flex bonding • Flip chip TECHNOLOGIES IN THE CLEAN ROOM • Die bonding • Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding) • Glob top casting • Optical casting • Application of HF seals
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Gold wire - Import exportNumber of results
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