Clean technology - Import export

This manual vertical slicer offers you a unique high-end performance package. Simplify your processes with the intelligent support SmarterSlicing: The digital display will automatically indicate you when it's time to clean, sharpen or maintain the VSP. Your benefits: You ensure high quality of your products and optimize your processes. The VSP offers you more than just average. Its innovative Smarter slicing functions support you in obtaining perfectly sliced fresh products at any time. An early warning system by means of indicators will notify you when the VSP is due for cleaning, sharpening or maintenance. Smart technology to ensure the availability of your machine. Yet another highlight for you: You centrally control the SmarterSlicing function and log the data. The ideal basis in order to optimize your processes in the long term. The FoodConnect interface and the RetailControl management software make it possible.

The JET One prints on plastic, glass, wood, metal, ceramic, technical composites, cardboard and paper, without contact, and with fixed and variable data: such as use-by dates, LOT/batch numbers or even graphics. From every position and in every direction. Forward, backward, mirrored or rotated. Even different product surfaces – whether convex, concave, rough, smooth, flat or relief-molded – pose no challenge at all for the JET One. Equipped with the automatic SEALTRONIC nozzle sealing system, the JET One is ready to print in just a few seconds and always begins with a clean print image. This unique technology worldwide ensures 100% protection against ink drying out – even after prolonged downtime. Time-consuming and labor-intensive rinsing cycles and daily servicing are eliminated. And printer-related production losses are a thing of the past.

RAFI Eltec has over 20 years of experience in the special technology chip-on-board. That gives us a profound understanding of processes and quality in the standard technologies and beyond. As a result, we meet your requirements for flexible and reliable implementation of technically sophisticated solutions. We even set new standards. CHIP-ON-BOARD TECHNOLOGIES • Chip-on-board bonding • Chip-on-chip bonding • Chip-on-flex bonding • Flip chip TECHNOLOGIES IN THE CLEAN ROOM • Die bonding • Wire bonding (aluminum wire bonding and gold wire wedge-wedge bonding) • Glob top casting • Optical casting • Application of HF seals