Solder resist - Import export

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au with solder stop mask Pitch 0.40 mm (15.7mil) and 0.50 mm (19.7 mil.) Adaption board for 23 different SMD-QFP s Hole diameter 1.00 mm Prescratched rated break point for the separation of individual modules from the board Gerber data for manufacture of the solder resist masks and the soldering paste imprint will be provided free of charge on request Size 132 x 203 mm

Technical data •Max. Panel size up to 1500mm x 670mm •PCB thickness from 0.1-17.5mm •Smallest hole 0.075mm •Smallest trace/spacing 50µm •Copper layer up to 1000µm •Number of layers up to 58 •Aspect Ratio 20:1 •Rigid flex and flex •Viaplugging •Impedance control •Laser Microvias •Blind, Buried Vias Basic material •FR4, FR4 High TG, FR4 •halogen-free, CEM1/3, Rogers, •Ceramic (Al2O3), polyimide and others Surface •HAL lead-free, HAL Pb/Sn, chem. Ni/Au (ENIG), chem. Ni/Pd/Au (ENEPIG), chem. Sn, chem. Ag, OSP(Entek), galv. Ni/Au, Carbon, Ag/Pt (thick film technology) and others Solder resist and placement printing •Different paint systems (including halogen-free) and colors Standards •ISO 9001:2015 / IATF 16949 •UL listing •RoHS / REACH •Manufacturing according to IPC A600 class 2 and 3 Delivery times •Rush service from 1 AT •Series from 10 AT Data preparation •Legacy document preparation •Scan Service •Data conversion •CAM data preparation •CAD layout service

TITANIUM The new generation of wave soldering systems – lead free soldering without corrosion. TITANIUM is the innovative soldering solution developed by STRECKFUSS SYSTEMS. It uses titanium, an agent which is extremely lead free solder resistant. For this reason, titanium works perfectly in lead free soldering processes. An oxide film immediately covers all material damages and thus prevents corrosion. In contrast to wave soldering systems with stainless steel components, titanium is not subject to corrosion even when lead free solder is used. By means of a simple and safe solder bath exchange, TITANIUM makes it possible to switch flexibly from a standard soldering process to lead free production. This ensures maximum flexibility at minimum costs and easy handling. TITANIUM is a complete system and includes: Spray fluxer with extraction hood Double wave 3- D wave (for the prevention of solder bridges) Infrared preheating Microprocessor controls Soldering frame transportation system