Smd mounting - Import export

• According to DIN EN 61810-1, DIN EN 60664-1 • Power miniature relay for SMD mounting • High switching power AC 250 V / 5 A • High dielectric strength 4 kV • High limiting continuous current Ith = 5 A • Compact size V = 2,47 cm3 • Safe separation L + K ≥ 5,5 mm EN 50178

Epoxy fibre-glass FR4 1.50 mm Single-sided 35 µm Cu Without holes Hot air leveling (HAL-leadfree) with solder stop mask Component print PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip Kond. 6 x 1812 Chip Kond. 2 x 2220 Chip Kond. 1 x 2308 Melf 2 x 1206 Mini Melf 6 x Suitable for Pick & Place PCB for 57 solder practices for implementation into the SMD surface mounted device: version quantity PLCC 20, 68 QFP 84 sq. TSOP32 1 x SO14 1 x SOM16 1 x SOL20 1 x SOT23 3 x SOT143 1 x SOT89 2 x SOT233 1 x DPAK 1 x Poti. 1 x Tantal Chip Kond. A 1 x Tantal Chip Kond. B 1 x Tantal Chip Kond. C 1 x Tantal Chip Kond. D 1 x 1206 Chip Kond. 10 x 0805 Chip Kond. 10 x 1210 Chip...

• Universal use with various enclosure types • High current (5 A per bus pcb-rail) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

• Universal use with various enclosure types • High current (5 A per bus pcb-rail) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

• Universal use with various enclosure types • High current (5 A per power cable) • Quick and easy mounting in the DIN-rail • Contour and layout of the bus pcb can be according to customers' requirements e.g. defined by the customer • Designed for standard DIN-rail dimensions • Large stand-off to DIN-rail floor allows the mounting of SMD components on the bus pcb underside • The carrier profile is securely fixed by safety caps (left and right) on the DIN-rail • Pcb rail "breaks" are possible, e.g. for operation of bus signals inside instruments

Certain plastic encapsulated surface mount devices (SMDs), if not handled properly, can incur damage during the solder reflow attachment process to printed circuit boards (PCBs). In order to prevent damages, the moisture sensitive product is typically baked before packing. After baking, the product is placed inside a DryPack bag along with predetermined amount of desiccant and a humidity sensitive indicator card (refer to JEDEC JSTD033C). The vacuum sealed bag is labeled and placed in a pizza box carton.