Salvaging of thermoplastic materials - Import export

At OptiMel, you get everything from a single source to optimally use low pressure molding technology for high-quality electronics encapsulation. Thermoplastic hot melts are used as encapsulation material. Due to their range of properties, amorphous thermoplastic polyamide granules are predominantly used in low pressure molding. Thermoplastic polyolefins are also available for special applications, which are used whenever sufficient adhesion cannot be achieved with the preferred polyamides on the substrates used (e.g. cross-linked polyethylene). Due to different raw material combinations, the range of properties of these hot melt granules varies in terms of mechanical strength, operating temperatures and resistance to various media. The hot melt molding materials combine a viscosity spectrum that is favorable for the low-pressure process with a wide operating temperature range (-50 / + 150°C) and, in some cases, very good adhesive properties. Depending on the material