Thermal profiling - Import export

The sensor technology of the DCT 533 is the same as those of the proven pressure transmitter DMP 331 / DMP 333, whereby the DCT 533 is suitable for almost every industrial application, if medium is compatible with stainless steel 316L. The modular concept of the pressure transmitter allows customized electrical or mechanical connections, so it is easy to adapt the DCT 533 to different conditions on-site. Features: — nominal pressure: 0 ... 100 mbar up to 0 ... 400 bar — accuracy: 0,35 % (opt. 0,25%) FSO — IO-Link according to specification V 1.1 — Data transfer 38.4 kBaud — Smart sensor profile — perfect thermal behaviour — excellent long term stability Optional Features: — pressure port G 1/2" flush from 100 mbar — pressure sensor welded — customer specific versions

Developed within the Intel® Embedded Building Blocks Initiative A modular Embedded PC platform based on COM Express Suitable for: Individual Embedded systems (Integration in devices / equipments) Embedded PCsIndustrial PCs / BoxPCs Panel-PCs Display systems / Digital Signage Embedded PC - as easy as a standard PC Key functionalities Modular concept Scalable (from Intel ®Atom ™ bis Intel ®Core ™ i7) Space-saving through slim profile Optimal thermal connection and simple system integration Mainly passive cooling Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany" Realisation of hardware kits, Box-PCs and Panel-PCs/HMI Now also available with Intel Core 3 rd generation ("Ivy Bridge")!