Mechatronics - Import export

Customer specific optomechanical and optomechatronic components Our strengths lie in the development and construction of optomechatronic systems from the feasibility study on the prototype tofit system integration. The earlier we are involved in your development process, the more we can do for you. Our experience shows us that especially innovative systems and product ideas benefit from a close partnership. This is what we stand for. In addition, we offer our customers service performance measures and technological support, when it comes to ensuring the quality of their products or production facilities. We measure and test according to your specifications. We make sure that you do everything right from optical design to imaging.

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).