Annealing - Import export

Our modular control packages are customized to significantly improve your annealing / bright annealing / normalizing operations, meet industry standards requirements and ultimately provide you with precise and reliable process control. We offer compact, fully automatic modules for new installations or retrofits. Each solution consists of a cost-effective module or combination of modules delivered with state-of-the-art equipment and backed by our extensive technological expertise. Annealing / Bright annealing / Normalizing control Solution is supplied with a PROTHERM controller and either an AccuCarb® LTA probe or FurnaceDoctor® FX analyzer or with Protherm ActivePLC™, FurnaceMeter™, AtmoSense™ and UPC oxygen probes for a variety of furnace types. FEATURES • AMS 2750, CQI-9, NFPA 86-C, NADCAP* • Latest achievements in process control • Cost-effective module configurations * depending on the options chosen

Dry lubrication for applications where pastes or powders have been used up until now Chain lubrication of heavily loaded chains in temperature ranges in which oil or grease lubrication is not possible For example, in annealing, stoving and baking ovens for aluminium tube manufacturing, in painting systems or in baking lines Advantages and benefits Hygienically harmless as defined in German LFGB Approved by Nuremberg LGA for use in food processing technology NSF H2 registered Economical due to low consumption Optimum wear protection at high pressures and extreme temperatures Can be mixed with water in ratio of up to 1:5

Spring steel is a model of load-bearing capacity. Characteristic for this material group are homogeneous microstructures and optimal surfaces. It stands for above-average service life, dimensional stability and constant quality in every end product. Spring steel obtains its special properties through special treatment in the production process, whereby the even distribution of the carbon content is of particular importance. It undergoes several rolling processes and repeated heat treatments in numerous work steps - this is how we guarantee optimum quality for your products! C 67 S - C 100 S/➔ according to DIN EN 10132 - 4 Depending on the customer's requirements, we supply treatment states from soft annealed to high cold solidified.

This material group stands for breaking strength, service life and wear resistance. Due to these properties, quenched and tempered steel is always used where high strength, yield strength and high toughness are required for highly stressed machine parts. C 22 E, C35 E, C 45 E/➔ according to DIN EN 10132 - 3 Depending on the customer's requirements, we supply treatment states from soft annealed to high cold solidified.

Our modular control packages are customized to significantly improve your annealing / bright annealing / normalizing operations, meet industry standards requirements and ultimately provide you with precise and reliable process control. We offer compact, fully automatic modules for new installations or retrofits. Each solution consists of a cost-effective module or combination of modules delivered with state-of-the-art equipment and backed by our extensive technological expertise. Annealing / Bright annealing / Normalizing control Solution is supplied with a PROTHERM controller and either an AccuCarb® LTA probe or FurnaceDoctor® FX analyzer or with Protherm ActivePLC™, FurnaceMeter™, AtmoSense™ and UPC oxygen probes for a variety of furnace types. FEATURES • AMS 2750, CQI-9, NFPA 86-C, NADCAP* • Latest achievements in process control • Cost-effective module configurations * depending on the options chosen

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.