Sensors - Import export

Another working area of the Suvis GmbH is the field of innovative sensor systems applied to particle and flow measurements taking into account microsystems. We develop novel flow and particle sensor systems for the application in environmental technology, process and mechanical engineering, and automotive technology. Important aspects are robustness and economicalness of the complete sensor system in order to create for the above mentioned application fields practical and affordable solutions. The respective sensor system will be developed as a whole solution. This means besides the hardware set up that we also take care of the evaluation of the sensor signals with our own solutions. We develop from scratch up to prototype level including periphery technology development. Please contact us for a not binding offer. We would like to know more about your challenge!

The Suvis GmbH offers flat pressure sensors (see photograph), which we produce ourselves and which can be used for classical static pressure measurements on solid surfaces like automobile frames. The flat pressure sensors are applied especially in cases where one cannot place a borehole in the respective surface. Hence, flat pressure sensors represent “transportable” static pressure boreholes, which one can glue on the surface of the flow body. The photo shows typical flat pressure probes. Typical dimensions are 17 mm (diameter of the flat disc) and 0,5 mm as diameter of the pressure borehole. The disc consists of bronze, while the measurement tube is made of high quality steel. In order not to interfere with the flow the discs are chamfered around their periphery. When producing the flat pressure sensors for you we can take your individual design requests into account. Simply contact us for a nonbinding offer.

Fuel level sensor for wheel loader FERRUM DM416 x4 . Will be delivered like shown.

Optimize your reflective media options Porex provides a portfolio of highly reflective components for optical sensors and other sensors that use or gather light. Our pure POREX® Virtek™ PTFE reflective components have industry-leading UV and visible light reflectivity. Available in rolls, sheets, die-cut parts, or custom 3-D shapes to meet your application needs, our reflective materials: Eliminate hot and dark spots–POREX® Virtek™ PTFE reflects light in all directions, causing the light to be spread evenly across a surface and eliminate hot spots. Increase efficiency – With more than 97% average reflectance over the entire light spectrum, our reflective materials capture wasted light and deliver directly to the lighting task. High temperature tolerance of up to 260°C

Safely facilitate electrolyte chemical reactions Electrolyte reservoirs and wicks are needed to retain and deliver an electrochemical system’s electrolyte to facilitate the chemical reaction. POREX® fiber and foam media can be used for reservoirs, general wicking, and supporting of fluids within electronics and sensors. Engineered for optimal capacity and directional flow, our electrolyte reservoirs and wicks: Minimize inhalation and skin hazards–Made from safe-to-use PP or PE, our materials eliminate the need for glass wool, which can cause skin irritations and health issues when inhaled. Meet your application specifications–Product fluid retention, density and flow orientation can be tailored to meet your specific application needs.

The microVEGA™ xMR system provides high throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA™ xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production. The microVEGA™ xMR uses on-the-fly spot and variable laser energy to provide selective heating of the pinning layer in each sensor in order to “imprint” the intended magnetic orientation. Magnetic field strength and orientation is adjustable by recipe, while high temperature gradients ensure low thermal impact. This allows sensors to be processed directly next to readout electronics as well as closer together, and enables the production of smaller sensors—freeing up space for processing more devices per wafer.