Pulsed laser - Import export

Due to their compact and flexible design, LS series laser machines guarantee an easy entry into the world of laser processing. We offer manual and automated solutions: - Palletising systems - Bar and coil feed systems - Pick-and-place systems - Robots You can realize the following laser material processing with the LS series: - laser machining for welding, clean welding, cutting, drilling, hardening, and structuring - micro processing - integration of CO2 , Nd: YAG, diode, fibre or disk-type lasers and ultra-short pulsed laser Please get furher information at Download.

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

The microPREP™ PRO system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics. Therefore, with microPREP™ PRO material samples can be prepared effectively and economically by using an ultrashort pulse laser. microPREP™ PRO allows to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures like in advanced packages, such as through silicon vias (TSVs), or even complete systemsinpackage (SiP). Furthermore, it is ideal to provide larger sized samples with microlevel precision. The integrated overview camera assists in navigating on larger samples – the high definition process camera allows for exact positioning. Moreover, the application of a picosecond laser ensures virtually no structural damage and no elemental contamination of the material.