Material fur - Import export

Finishing centers for the jewelry industries, the machines range s210/ s220 combine several processes such as Milling, Engraving, Drilling and Faceting to produce parts for the most demanding key players of the jewelry crafts worldwide. His legendary finishing qualities best fit the requirements in terms of accuracy and ease of use. Features 6 to 8Axis Faceting, engraving, drilling, milling 2 spindles with changer and tool magazine High frequency 45.000min1 spindle Easy changeover of the programs CNC control unit Siemens 840Di

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.