Manufacturers - Import export

With the addition of a moveable table, traversing through the twin column portal design of the VC machine range, the VCV provides the ultimate flexibility for machining large components. In addition to the «on center» machining capability of a standard lathe the VCV machines are able to machine eccentric features. With the use of our extensive range of standard milling and drilling attachments, the VCV machine range is capable of full 5 sided machining of components up to 12,000 mm in diameter and 350 tons in weight. On machines with a Yaxis the component can be machined in any position. The turning table is set on a sliding bed. The default Yaxis travel corresponds to the swing diameter of the machine size, but can be tailored to suit any application.

Fewer rejects thanks to high concentricity and axial runout accuracies (< 2 μm) Wide manufacturing range thanks to precise and powerful table drive (torque motorIncreased productivity through complete machining in just one setup

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

The advanced microCELL™ MCS laser cutting system has been developed to meet the photovoltaic (PV) market’s demands for boosting module power output and service life by minimizing power losses and providing for an exceptionally high mechanical strength of cut cells. It enables the highest throughputs for cutting cell sizes up to M12/G12 into half cells or shingled cells. The microCELL™ MCS system takes advantage of 3DMicromac’s patented thermal laser separation (TLS) process for cell separation. The ablation free technique guarantees an excellent edge quality. The microCELL™ MCS system offers half and shingled cell cutting for improved module performance. The TLS Technology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significantly higher module power gain and less module power degradation.