Transfers - Import export

A 4station transfer machine A compact industrial concept for maximum performance taking up minimum floor space With its dual spindle concept enabling concurrent tool change operations, its high dynamic acceleration, its powered spindles capable of a rotation speed of up to 60.000 min1, its high number of tools, the s100 is a modern production tool pushing back the boundaries of highprecision machining. The s100 range makes it possible to produce highly complex parts. Ideal for 3 axis machining of watch movement parts, it has also proven itself unbeatable in a whole host of fields, such as mobile telephony, electronics or nanotechnologies. Features Unique dual spindle concept Highly dynamic acceleration, up to 3g 4 machining stations Up to 36 tools integrated into the machine

The Bumotec s1000 C horizontal transfer machine was designed to manufacture prismatic parts from round or profiled bar stock. Small and complex components can be efficiently machined in medium to large batch sizes. The machine is configured with seven 4axis machining stations, each equipped with 4 machining spindles (2 horizontal and 2 vertical). The eight stations comprise a 4axis cut off station with a single spindle. An optional ninth station allows the component to be reclamped to allow the sixth side of the component to be machined with an additional 3axis, 3 or 4 spindle machining unit. The machine is equipped with an automatic bar feed and quick change tool clamping system for optimum production rates. Features 9 machining stations Up to 36 tools integrated into the machine

3DMicromac’s brand new microCETI™ uses the most innovative LIFT (Laser Induced Forward Transfer) laser process, which is an essential factor in the process chain for manufacturing microLED displays. The fully integrated laser system is characterised by its compact footprint and high variability. The microCETI™ enables the transfer of hundreds of millions of microLEDs without the use of mechanical forces, thereby ensuring that microLEDs of almost any shape and size can be transferred. This ensures cost-effective production of microLED displays. Most cost-effective production of microLED displays Unique LIFT module Highest transfer rate ten times faster than competing technologies Flexible software for integration into production lines Handling options for wafers (up to 8″) and sheets (up to Gen.2)