Laser systems - Import export

Do you have individual requirements for your laser processing center that our standard laser system of the LS series cannot meet? We develop together with our customers from stand-alone systems to integration into existing lines. In doing so, system know-how meets automation and laser technology: - robot solutions - portal variants - rotary table machines - sliding table systems - scanner solutions - integrated solutions based on VARIOMODUL® or, - at your request, on standard laser machines of the LS series For further information please take a look at our homepage.

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

3DMicromac‘s microMARK™ MCL is a compact and maintenance free DPSS laser system to meet customer’s demand for high quality laser engraving with significantly decreased cost of ownership. The system is utilized for visible, invisible as well as for technical engravings of all kind of spectacle lenses as well as marking of hard and soft contact lenses. The use of a UV DPSS laser source achieves a high quality marking result comparable to excimer laser engravings. High quality laser engraving Accurate contrast adjustment Low investment and operating costs Maintenance free laser source Plug-and-play replacement of main components directly by the customer High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings

The production of ophthalmic lenses requires different marking processes, e.g. technical engraving and branding for spectacle lenses as well as UDI marking for contact lenses. 3DMicromac offers ophthalmic marking solutions for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking and guarantee Highest engraving precision Accurate contrast adjustment Reliable process stability Maximum throughput Top availability Flexibility in system configuration and Simple retrofitting. 3DMicromac‘s customers can choose between premium quality excimer laser systems and high quality maintenance free DPSS laser systems. Both are suitable for the production of technical engravings and visible branding on blocked and unblocked lenses, as well as contact lenses. The microMARK™ MCF excimer laser system generates the engravings by cold laser ablation of 193 nm UV radiation.

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

3DMicromac’s microMIRA™ LLO system provides highly uniform, force free lift off of different layers on wafers at high processing speed. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The laser system can be used for a variety of applications, such as GaN lift off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing. Additional applications include laser annealing and crystallization for surface modification. Force free and extremely fast line beam laser processing No damage due to thermo-mechanical effects Low production costs Elimination of costly and polluting wet chemical processes Integration of adjacent manufacturing steps for higher fab productivity

3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates. Free form cutting with extraordinary quality Damage free cutting edges Contactless processing enables minimal cost of ownership Cutting speed up to 1.5 m/sec Laser sources according to customer requirements Up to 3 independent beam paths

3DMicromac’s brand new microCETI™ uses the most innovative LIFT (Laser Induced Forward Transfer) laser process, which is an essential factor in the process chain for manufacturing microLED displays. The fully integrated laser system is characterised by its compact footprint and high variability. The microCETI™ enables the transfer of hundreds of millions of microLEDs without the use of mechanical forces, thereby ensuring that microLEDs of almost any shape and size can be transferred. This ensures cost-effective production of microLED displays. Most cost-effective production of microLED displays Unique LIFT module Highest transfer rate ten times faster than competing technologies Flexible software for integration into production lines Handling options for wafers (up to 8″) and sheets (up to Gen.2)