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Germany
Besides the processing of rigid and flexible materials on rigid substrates, we also offer the processing of flexible materials using sheet-to-sheet or roll-to-roll processes: - Laser micro structuring and ablation - Laser processing “on-the-fly” or “step and repeat” - Roll width up to 300 mm possible
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Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials
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Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material
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Laser fine cutting - Import exportNumber of results
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