Diode lasers - Import export

Due to their compact and flexible design, LS series laser machines guarantee an easy entry into the world of laser processing. We offer manual and automated solutions: - Palletising systems - Bar and coil feed systems - Pick-and-place systems - Robots You can realize the following laser material processing with the LS series: - laser machining for welding, clean welding, cutting, drilling, hardening, and structuring - micro processing - integration of CO2 , Nd: YAG, diode, fibre or disk-type lasers and ultra-short pulsed laser Please get furher information at Download.

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.