Laser optics - Import export

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.

3DMicromac‘s laser system microMARK™ RXe has revolutionized the efficiency of blocked lens engraving by using excimer lasers. Equipped with an optimized optical components setup and a large sized magnification ratio, this new generation of RX marking devices offers an increased depth of focus at lowest laser power operation on all materials. Customers benefit from low investment and small operating costs. High quality engraving Accurate contrast adjustment Low investment and operating costs Reliable process stability Smallest excimer system footprint available on the market High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings Smallest required space on the market Low investment and operating costs Easy retrofit of automated handling system at customer’s site on request