Industrie - Import export

The vertical lathes of the TVU product line of Berthiez are especially suited for machining engine and turbine components, which are primarily used in the aerospace industry as well as for alternative and classical power generation. The TVU vertical lathes are characterized by a complete cast design, highprecision static and dynamic positioning as well as longlasting reliability. Advantages of the TVU vertical turning lathes are, completely cast iron construction, high static and dynamic axis stability, high accuracies and long term reliability. For higher flexibility the machine can be equipped with several pallet change systems and adaptable milling heads. The optional Yaxis table traverse will permit the turning, milling and grinding of complex components in a single clamping.

High performance 6 axis machining center The STC series has been designed to provide unrivalled economy in the machining of the most demanding structural parts, multiblades and casings with long cycle times, and provide the customer with a whole host of practical options. These machining centers have excellent static and dynamic properties as well as a tried and tested rotatable head, making them the benchmark for heavy chip removal in titanium and Inconel part for the aerospace and power generation industries.

High performance simultaneous 5 axis machining center The STC series has been designed to provide unrivalled economy in the machining of the most demanding structural parts, multiblades and casings with long cycle times, and provide the customer with a whole host of practical options. These machining centers have excellent static and dynamic properties as well as a tried and tested rotatable head, making them the benchmark for heavy chip removal in titanium and Inconel part for the aerospace and power generation industries.

High performance simultaneous 5 axis mill turn center The STC series has been designed to provide unrivalled economy in the machining of the most demanding structural parts, multiblades and casings with long cycle times, and provide the customer with a whole host of practical options. These machining centers have excellent static and dynamic properties as well as a tried and tested rotatable head, making them the benchmark for heavy chip removal in titanium and Inconel part for the aerospace and power generation industries.

The STC series has been designed to provide unrivalled economy in the machining of the most demanding structural parts, multiblades and casings with long cycle times, and provide the customer with a whole host of practical options. These machining centers have excellent static and dynamic properties as well as a tried and tested rotatable head, making them the benchmark for heavy chip removal in titanium and Inconel part for the aerospace and power generation industries.

The RVU grinding machines set new standards in highprecision machining and are especially suitable for high precision grinding applications in the bearing and aerospace industries. The range can be equipped with up to four watercooled grinding spindles which can achieve a performance of 45 kW at 18,000 rev/min. (according to the type of grinding wheel selected) The RVU facilitates a complete machining processing without interruption as optional dressing units, grinding wheel changers and workpiece measurement are available. Additional options for hard metal machining boring and workpiece measurement increase the possible applications of the machine series considerably.

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.