Laminating systems - Import export

Thermal imaging system based on the Raytek MP150 infrared linescanner. Detailed web temperature profile based on 40,000 measurement points per second Automated temperature monitoring Automated quality monitoring for ISO9000 Ensures proper web temperatures for strong film-to-substrate adhesion Enables plant operators to reduce scrap and improve profitability and product quality Quick and automatic detection of “wavy” or “running” edges, gaps, and torn edges Define product-specific configurations (recipes) Automatically analyze “automatic sector” temperature distributions Visualisation on PC Playback stored files as “movie” Multiple language support Integrated OPC server for remote system control Ethernet TCP/IP interface integrated in the line scanning system PC-independent alarm output Analog outputs 3 x 4 – 20mA Analog or digital output modules For sheet extrusion see the Raytek ES150 system.

Permanent fixation of a chip module is crucial for every smart card to meet the different demands of ID cards, banking cards, GSM /SIM cards, and dual interface cards. The GTL700 is a highly reliable and flexible solution for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The glue tape is laminated onto the backside of the module tape. To accommodate the chip, holes are punched into the glue tape prior to lamination. The system operates stand-alone or inline, and is suitable for a wide range of IC module tapes. Various punching and laminating tools are available, which can be exchanged with a few simple steps. Optional reel units allow use of an additional protection tape and separation of carrier tape. Highest yield, maximum machine uptime and short product changeover times lead to very low cost of ownership Up to 8,000 chip modules/hour High flexibility for all IC module types and sizes, including dual interface Adjustable...

Encapsulation is the method for protecting the chip and wires against mechanical stress and environmental influences. For this purpose, cast resin is dispensed and then cured by UV light or heat, depending on the type of resin. The PowerSeal offers highest quality and maximum speed for the encapsulation of chip modules with up to 40,000 modules/hour. PowerTest - Chip Module Test System The inspection of IC modules for smart cards and RFID devices, based on parametric and functional testing, is an integral part in the production flow and quality assurance. The PowerTest is designed for high-speed testing and encoding of chip modules on 35 mm tapes. The system is also perfectly suited for initialisation and personalisation of IC modules, including OS loading. GTL700 - Glue Tape Lamination System The GTL700 is a highly reliable and flexible system for glue tape lamination of chip module tapes in preparation for the hot melt implanting process. The very efficient system can...

The production of electric motor and generator laminations imposes strict requirements on the press and automation. ANDRITZ Kaiser looks back on decades of experience in the electric motor laminations sector and provides the customer with state-of-the-art solutions. Precise timing and general performance are required for competitive productivity of high speed stamping systems for laminations. Due to the large amount of cutting operations required, a very rigid machine is needed to absorb the cutting impact without damaging any machine part. Finally, the tolerances of 0,02mm in the tools and the end product call for a very precise slide movement, slide guideance and low frame deformation. Our well designed and thoroughly tested concept allows customers to manufacture high-quality products with maximum efficiency. ANDRITZ Kaiser production lines for electric motor laminations are characterized by the following features: Highly stable machine with split-design, cast iron frame for...

Automatic Laminating System AKS vario Suitable for different materials, such as wood, synthetics and metals. Applicable for irregular profiles and working width at buyer´s request.

Polyester resins (UP resins) form the basis of our product range in the glass fibre reinforced plastic systems business area – with a wide variety of applications. They range from thixotrope standard systems for manual lamination and fibre spraying to low-viscosity standard formulations for polymer concrete and sanitary applications to numerous special formulations for specific requirements. With a broad spectrum of properties and applications, our UP resin systems are suitable for products in a wide variety of industries. Typical properties Dense matrix / composite of approximately 1.1 g/cm³ / 1.5–1.7 g/cm³ Fibre content 25-50 % of total weight Moulded part mass per unit area of 4500-8000 g/m² Flexural modulus of elasticity 5000–25,000 MPa (with reinforcing mesh) Bending resistance of 130–260 MPa (with reinforcing mesh) Impact resistance of 45–95 KJ/m² Reinforcing materials: Continuous or cut glass fibre mats, fleece Mesh Non-crimp fabrics Special formulations and versions Styrene-reduced, environmentally friendly formulations Low-viscosity injection resins with reduced exothermic peak Formulations for the pultrusion process Systems with high chemical and hydrolysis resistance DIN 1140 versions with special mechanical values and dimensional stability under heat greater than 100 °C (HDT > 100 °C) Resins with good adhesion for combination with PVC Resin systems with shipping industry approval: Det Norske Veritas/Lloyd’s Register of Shipping/Germanic Lloyd Coordination with gel coat/top coat for surface refinement Flame protection formulations Electrical industry: UL 94 V0 Rail vehicle construction: DIN 5510 (S4, SR2, ST2)