Results for
PRECISION SURFACING SOLUTIONS GMBH & CO. KG
Germany
The DW292 is specifically designed for cutting monocrystalline silicon ingots up to 300mm diameter into high quality wafers for the semiconductor industry. The newly developed DW292-300 can be operated with slurry wire, as well as with diamond wire, and has sophisticated features for optimizing warp and ripple. The longer wire field, as well as the higher wire speed and acceleration, enable a higher throughput per machine and year. The use of extremely thin wire is possible thanks to smaller inertia of moving parts, fewer deflection rollers and shorter wire distance. The DW292-300 is highly resistant to temperature fluctuations and vibrations due to its compact and robust machine frame made of mineral casting. Thanks to higher process automation and the new intuitive HMI with dialog-based production wizard, operation is safer, easier and faster.
Request for a quoteDo you sell or make similar products?
Sign up to europages and have your products listed
Results for
Diamond wire - Import exportNumber of results
1 ProductCountries
Company type
Category