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Germany
Low shrinkage optical camera module adhesive with LED and/or heatcure for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. Features: - Rapid LED or UV/Visible light and/or heat cure - Very low volumetric shrinkage - High Tg and Low CTE - Low ASTM E595 Outgassing - No frozen storage, refrigerated shipment/storage 15°C [3441° F]
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Low shrinkage optical positioning Epoxy with LED and heatcure capability. Features: - Fast cure with LED or UV/Visible light - Low temperature heat cure (8085°C) - Low shrinkage and CTE - Single component - Cold ship/Cold storage at 15°C - Passes ASTM E595 Outgassing Testing
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