Diode lasers - Import export

Microassembly device for assembling laser diodes

NanoSolder actively aligns optical components such as photonic circuits, waveguides, diode lasers and photodiodes. It uses selective laser soldering for the assembly. Compared to gluing with subsequent curing, much shorter assembly times will be achieved by selective laser soldering.

NanoGlue serves as the ideal assembly station for opto-electronic components, such as photonics circuits,waveguides, diode lasers and photodiodes as well as lenses and modulators. It provides active alignment in all six degrees of freedom followed by epoxy gluing with UV curing.

The fully automated assembly station VersaGlue takes components, such as lenses or dies from a loading area and mounts them by epoxy gluing with UV or thermal curing. The large work area of up to 1000 mm x 1000 mm provides space for the positioning of device trays and support systems. The parts are presented manually or fully automated. Feeders or stop-motion conveyor belts bring the parts to the working area and collect the finished product. The VersaGlue processes optoelectronic elements like VCSELs, photo diodes, laser dies and micro optics with highest precision while the passive placement of fiber ribbon cables is another major application.Thorough design and continuous optimization of all functional groups lead to superior mechanical stability. Mechanical references with tight tolerances provide a repeatable manufacturing operation from device to device.

All NanoTest stations combines precise measurements with high speed, proven reliability and ease of use. The versatility qualifies the stations not only for high volume quality assurance, but also for demanding development applications. This qualification helps to differentiate well-working devices from the ones with mediocre performance. In this way, unnecessary processing of low-quality devices is avoided early and possible problems during wafer production will be determined. NanoTest-W characterizes the optical and electrical behavior of VCSEL or Silicon Photonics chips on wafer level, while NanoTest-C is used for laser diodes, receivers and passive devices on bar or chip level.

The KLN QSW 400 L is a modular laser welding machine. The advantage of the modular structure is that the central laser welding machine can remain unchanged in the various welding tasks and only the housing and its frame structure must be adapted to the actual welding task. Thus, a well-tried laser welding unit can always be used. Moreover, adaptions to other welding tasks can be easily integrated, e. g. with rotary table, tool carrier, conveyeor or sliding table. Laser: Water-cooled diode laser with 300 W optical output power Wave length 980 nm ±10 nm Pilot beam at 650 nm ±15 nm (<1 mW) Optical fibre suitable for wave length 780-1030 nm Focal distance of collimation 58 mm Focal distance f-theta objective 635 mm Operating distance 728 mm Operating field (scan field) 415 mm x 415 mm