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With an EtherCAT master and two additional CANopen interfaces the new CODESYS control Scout from Kendrion can be used as an HMI and control unit.The simple CODESYS V3 programming ensures an efficient engineering. Furthermore, Scout has optionally 4 digital inputs and outputs. The embedded system is based on a scalable single or multicore i.MX6 processor technology combined with a 7” to 15.6” TFT touch display. All components are robust and long-term available. Whether standard or customized the all in one solution is the better alternative in many devices and compact machines. The Scout series can be equipped with different software packages, please contact us for an individual offer.

With an EtherCAT master and two additional CANopen interfaces the new CODESYS control Scout from Kendrion can be used as a HMI and control unit. The simple CODESYS V3 programming ensures an efficient engineering. Furthermore, Scout has optionally 4 digital inputs and outputs. The embedded system is based on a scalable single or multicore i.MX6 processor technology combined with a TFT touch display. All components are robust and long-term available. Whether standard or customized the all in one solution is the better alternative in many devices and compact machines. ; The Scout series can be equipped with different software packages, please contact us for an individual offer. ; Industry standard interfaces ; Front with seamless film cover ; CODESYS V3, real-time clock

The xiC camera line is highly versatile with a wide range of the most modern global shutter CMOS sensors up to 24.5 Mpix in resolution. The ultra-compact form factor, barely larger than the C-mount, combined with micro-B, type-C, and flex ribbon connectors make these cameras the perfect fit for various applications, especially for automation and embedded vision systems. For the same form-factor and sensor options, but increased bandwidth of 10 Gbit/s resulting in doubled frame rates, there is the xiX family. - Compact cameras with Sony Pregius™ sensors - 26 x 26 x 33 mm - Fast speed from 2.3 Mpix at 165 FPS to 12 Mpix at 31 FPS - Cool economy - Low power consumption with under 3 watts

The xiQ camera series is highly versatile with a selection of popular and established CMOS sensors. The ultra-compact form factor, barely larger than the C-mount, combined with micro-B, and flex ribbon connectors make these cameras the perfect fit for various applications, especially for automation and embedded vision systems. Board-level variants enable custom intgerations into devices and systems, while taped-glass sensor options minimize interference effects in photonics applications. - Most compact cameras - 26.4 x 26.4 x 26 mm small and 27 grams - High frame rate: 500 FPS at VGA and 1000 FPS at 640 x 400 - Low power consumption down to 1 W and minimal heat dissipation - 5 Gbit/s interface 400 MB/s data throughput

With CANopen, the user organization CAN in Automation (CiA) has created a protocol standard which has widely spread in embedded systems and mechanical engineering. CANopen specifications not only define various services for data exchange, they also specify standardized access to the systems via device profiles and application profiles. Target group CANopen training The target group of the CANopen workshop is development engineers who are looking for detailed knowledge about the communication profile or would like to get an insight in the CANopen / CANopen FD protocol stacks.

With the ruhlamat FILUS and the WCE2D, you can achieve large-area and precise wire-embedding results. In addition to wire embedding, pick-and-place handling and cutting, this 2D wire-embedding solution is also precise at soldering and dosing. 3D Wire embedding technology The WCEvario3D captivates through its flexible application options: From flat surfaces to concave and convex contours, the flexible robotic arm with a state-of-the-art wire-laying head and constant pressure-force control can handle all dimensions. 2D Wire embedding technology 2D Wire embedding technology With the ruhlamat FILUS and the WCE2D, you can achieve large-area and precise wire-embedding results. In addition to wire embedding, pick-and-place handling and cutting, this 2D wire-embedding solution is also precise at soldering and dosing. 3D Wire embedding technology 3D Wire embedding technology The WCEvario3D captivates through its flexible application options: From flat surfaces to concave and...

Short cycle times and reduced handling times. With the linear transfer systems from ruhlamat you will get flexible, modularly extendable automated solutions according to your requirements. Rotary Transfer Systems High quantities at low demands for flexibility can be implemented quickly and efficiently with ruhlamat rotary transfer systems. Robot Applications High versatility and easy convertibility speak for ruhlamat robot applications. With an unlimited range of applications our robot applications offer the greatest possible flexibility and high security of investment. Manual Workstations The efficient cooperation between man and machine is optimised by manual workstations from ruhlamat. Short transport routes between stations and semi- or fully automatic part handling are typical for our manual workstations. Wire Embedding Systems 2D and 3D wire embedding solutions with the highest precision and speed? No Problem with the machine solutions from ruhlamat! In addition to...

The WCE2000 is our fastest and most productive high-volume system for wire embedding and RFID inlay production. You get unrivalled real-world throughput with up to 4,050 antennas per hour as antenna embedding machine and up to 2,000 finished RFID inlays per hour as inlay manufacturing line. This modular and flexible system allows processing of various substrates and provides sheet to sheet (S2S), reel to sheet (R2S), or reel to reel (R2R) handling. WCE700 - Semi-Automatic Production System The very economical WCE700 can handle both small jobs and high-volume runs easily with up to 1,600 inlay sheets per hour. The system is capable to work with a wide range of substrates and can also be used for only antenna embedding, with unrivalled speed, accuracy and the quality of antennas that it produces. WCE150 - Laboratory System You are looking for a convenient solution for laboratory usage to produce prototypes or low-volume jobs? The affordably priced WCE150 is designed to produce...

The fan and cooling specialist SEPA EUROPE has now added three further models to its slimline radial fan series. The latest additions impress with their compact dimensions of 38 x 40 x 5 mm, 54 x 52 x 6 mm and 45 x 45 x 4 mm and have more than deserved the name „slimline“. All fans are equipped with the reliable Magfix sleeve bearings and have a service life of 210 000 h (MTBF) and 40 000 h /L10) at 40 °C. The PWM input in combination with the tacho output enables the speed to be controlled and monitored. It is not obvious at first glance, but the Model HY45AB05PNK00A tops with a pressure of 143 Pa. The new models will be included in the standard range and will therefore be available shortly from stock. SEPA EUROPE specializes in customized cooling solutions. Thanks to over 25 years of experience, SEPA EUROPE can offer you the appropriate solution for virtually every task.

SEPA EUROPE offers a 40 mm frameless fan especially for embedded systems. It is 10 mm high and provides a compact solution for chip cooling when used in combination with the appropriate heat sink. In addition to the 50 mm frameless fan which is already on the market, the new round 40 mm fan is also a much sought-after model for embedded systems. This is because many standard cooling solutions in this business sector are based on the 40 x 10 mm fan. Strictly speaking, the 40 mm fan has a rotor diameter of 37 mm. The version offered by SEPA EUROPE is equipped with two ball bearings and can boast a remarkable service life of 70.000 h at a temperature of 40°C. In addition to an impulse output for speed monitoring, it also has a PWM input for speed setting in the range of approx. 35 – 100% of the nominal speed. In conjunction with the power block pin-fin heat sink, this virtually silent fan with 22 dB(A) is also available ready for connection in the „Kühligel“ version.

Chip cooling with the aid of heat sinks usually requires a lot of space and is not only heavy but also expensive. The specialists at SEPA EUROPE have developed a chip cooler with minimum space requirements for compact designs. The core component of the compact cooler is the ultra-flat blower HY40H that is combined with a Kühligel® of pure aluminium. The special feature of the new cooling solution is its variability which means that the size and shape of the heat sink can be freely chosen. Users can thus assemble the cooler to optimally fulfil their requirements. With a thermal resistance of a mere 2.5 K/W, the new chip cooler withstands a power dissipation of up to 15 W and in doing so guarantees the operational safety of the entire embedded system. The blower is equipped with the highly durable Magfix® sleeve bearing and has an impressive service life expectancy of von 210 000 h (MTBF) at 40 °C.

Hardware kits based on Embedded PC Platform QSys A modular Embedded PC Platform based on Qseven Suitable for: Individual Embedded systems (Integration in devices/equipments) Embedded PCs Industrial PCs / BoxPCs Panel-PCs Display systems / Digital Signage Embedded PC - as easy as a standard PC Key functionalities Fully functional Hardware kit Available with Qseven modules based on Intel® Atom™ E3800 and AMD G-Series Optimized for Ultra Low Power Extended temperature range Onboard eMMC and mSATA socket Integrated Security Features Ultra compact design (10cm x 10 cm x 2.3 cm) Longevity Also usable as embedded alternative for Intel® NUC Standard boards (eNUC) Suitable for - Rapid Prototyping - small and mid range mass production

Hardware kits based on Embedded PC Platform COMSys A modular Embedded PC platform based on COM Express Suitable for: Individual Embedded systems (Integration in devices/equipments) Embedded PCs Industrial PCs / BoxPCs Panel-PCs Display systems / Digital Signage Embedded PC - as easy as a standard PC Key functionalities Scalable (from Intel Atom ® to Core ™ i7) Based on Mini ITX Defined mechanical and thermal connection Mainly passive cooling Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany"

Developed within the Intel® Embedded Building Blocks Initiative A modular Embedded PC platform based on COM Express Suitable for: Individual Embedded systems (Integration in devices / equipments) Embedded PCsIndustrial PCs / BoxPCs Panel-PCs Display systems / Digital Signage Embedded PC - as easy as a standard PC Key functionalities Modular concept Scalable (from Intel ®Atom ™ bis Intel ®Core ™ i7) Space-saving through slim profile Optimal thermal connection and simple system integration Mainly passive cooling Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany" Realisation of hardware kits, Box-PCs and Panel-PCs/HMI Now also available with Intel Core 3 rd generation ("Ivy Bridge")!

COM Express Mainboard (carrier board) Key functionalities For scalable platforms (from Intel Atom ® to Core ™ i7) Tested with many COM Express modules from different CPU module vendors. Applicable in Mini ITX systems Flexible extendibility Embedded features Long-term availability High level of functional reliability and durability (24/7) High quality "Made in Germany" Developed in the framework of Embedded Building Blocks Suitable for - Rapid Prototyping - Mass production in small, medium und large quantities