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Our thermal management and insulation products are far from being just interim solutions. The Thermal Interface Materials (TIM) from Seifert electronic GmbH ensure optimal thermal connection between heat sinks and the components to be cooled. As electronic assemblies become increasingly compact, even a tiny gap between individual components can disrupt the necessary heat dissipation. Air pockets between the heat sink and the component being cooled hinder the optimal thermal connection. Possible consequences include temperature overload, which can lead to overheating in the worst-case scenario. Thermal management and insulation products act as connectors between the heat sink and the electronic component being cooled. They fill every tiny gap between the heat sink and semiconductor with thermally conductive material. This ensures optimal thermal connection and prevents any heat buildup.
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