3d lasers - Import export

LARGE MARKING POSSIBILITIES With its 3-sided door, the LW3 benefits from the best inside height dimensions and can securely envelop and mark parts up to 628 mm high. Thanks to its compatibility with our Fiber, Hybrid, Green industrial laser series, the LW3 can mark with high precision nearly every metal or plastic surfaces on its special positioning table. VERSATILE From unique identification marking, to multi-level engraving, and matrix marking on a batch of small to medium parts, this industrial laser station can mark your large part at several positions, and levels. Add a 3D module to your LW3 laser to mark sloped parts. INDUSTRY ORIENTED This laser marking machine is the only large laser engraver of the market with an attached touchscreen allowing the operator to easily manage the direct part marking process. In addition to the easy installation, manutention, and silent/ergonomic door opening, this class 1 laser stands out with its exceptional build quality.

Microelectronic circuits continuously require new packaging technologies. Ceramic substrates are widely used in this field for their good dimension stability, high electrical insulation as well as their resistance to high temperature. But it is now possible to create microelectronic circuits on 3D carriers made with ceramics. This new type of component integrates electrical and mechanical functions on a same carrier, which gives a wider scope in terms of design and integration. Microcertec has developped a unique expertise to manufacture these ceramic 3D interconnection devices - CI3D - based upon high-precision ceramic grinding of a 3D carrier, thin-film metallizing and laser etching. These 3D interconnect carriers demonstrate the advantages of being made with advanced ceramics but they also offer miniaturization capabilities, enhanced reliability and more simple integration stages. In actual fact, the geometry of the carriers offers a 3D arrangement so that microelectronic...