Soldering circuit boards - Import export

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC Eprom 32 (1.27 mm) Hole diameter 1.00 mm Size 22.94 x 38.11 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu - Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 20 (1.27 mm) Hole diameter 1.00 mm Size 22.86 x 22.94 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 18 (1.27 mm) Hole diameter 1.00 mm Size 22.80 x 22.94 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm CU Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 28, 44 (1.27 mm) and QFP 44 (0.80 mm) Hole diameter 1.00 mm Size 38.10 x 40.64 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm) Hole diameter 1.00 mm Size 45.72 x 45.80 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 80,84 (0.65 mm) Hole diameter 1.00 mm Size 40.64 x 45.72 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 80 (0.80 mm) and QFP 100 (0.65 mm) Hole diameter 1.00 mm Size 45.80 x 50.80 mm

Epoxy fibre-glass FR4 1.50 mm Double-sided 35 µm Cu Plated through holes (PTH) Surface chem. Ni/Au and solder stop mask Adaption circuit board for QFP 32, 64 (0.80 mm) and QFP 64 (0.50 mm) Hole diameter 1.00 mm Size 38.10 x 45.80 mm

Green Polyester film, single coated with a rubber resin pressure sensitive adhesive. APPLICATIONS Masking in powder coating applications. Protects large areas of circuit boards from chemicals fumes or splashes. Masking of circuit boards during solder stripping and nickel/gold plating of contact fingers. PRODUCT BENEFITS Resists baking temperatures of 170°C to 190°C during 20min. Operating temperature range: ‐30°C to 130°C. Eliminates silicone contamination and need for PCB cleaning solvents. Easy application and removal. Non‐silicone adhesive removes cleanly. Good adhesion to substrate. Excellent conformability.

Kapton and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board

Kapton® and polyimide films with Silicone adhesive. They have been used in applications at temperatures as low as -269°C (-452°F) and as high as 260°C (500°F). high performance, reliability and durability, with a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments. Kapton® polyimide films make innovative design solutions possible in a range of industries including, consumer electronics, solar photovoltaic and wind energy, aerospace, automotive and industrial applications. Kapton® Tapes have a high dielectric strength. Silicon adhesive protection leaves no residue. Custom sizes are available upon request. Applications: Automotive sensor and manifolds Insulating circuit boards Etching Fiber Optics Cable High temperature powder coating Semiconductor manufacturing Wave soldering during circuit board