Contactless gripper - Import export

With the MicroLevi Gripper, sensitive materials can be picked and placed from above without any contact. It is used for handling small workpieces, such as small foils and glasses, dies, chips, and other small parts. Through a combination of vacuum and ultrasound, attractive and repulsive forces act simultaneously on the workpiece and keep it at a distance, even when gripping from above. As a result, no contamination or micro-scratches can occur on the small part. The MicroLevi gripper can be combined with tips of different sizes. Due to the small dimensions, the self-centering of the workpieces is guaranteed, so that no supporting side stops are required, and high-precision positioning is possible. The gripper can be moved sideways and swiveled. Features of the MicroLevi Gripper: - Contactless topside gripping - Self-centering of the workpiece - High-precision pick and place - No micro-scratches or other damages - No particles because no air turbulence

The LeviSolar-Gripper enables contactless gripping and depositing of solar wafers. Our technology guarantees the ultragentle and ultra-clean handling of the sensitive surfaces. When gripping the wafer, a combination of vacuum and ultrasound is used. The vacuum provides the attraction of the wafer and the ultrasound keeps the workpiece, with its repelling effect, at distance. Thus, no points of contact occur between the wafer and the gripper, and gentle handling is ensured. The LeviSolar-Gripper is available for different wafer sizes. The edge stops support the wafer to center itself and to stay in position. Features of the LeviSolar-Gripper: - Contactless overhead lifting - No carry-over of impurities and no micro scratches - No need for compressed air

With the RobotOverhead-Gripper it is possible to lift sensitive materials contactless from above by means of a robot. Besides from gripping, it can be used for (un)loading, sorting and singulating. The RobotOverhead-Gripper uses a combination of negative pressure and the Ultrasonic Suspension Technology to enable topside gripping of the workpiece. The substrate is kept at a distance, which enables contactless transport and prevents micro-scratches and contamination. Our technology allows a high flatness of the substrate during the handling process. The RobotOverhead-Gripper is suitable for battery cells, glasses, foils, lenses, packaging, wafers and other sensitive materials. It can be supplied in various versions, for example for the contactless transport of glass components in the manufacture of flat screens. Features of the RobotOverhead-Gripper: - Contactless topside gripping - High flatness of the substrate - Different dimensions - Safety hooks can be fitted as an option

With the LeviWafer-Gripper Transport system it is possible, to lift and transport sensitive Wafers contactless. In combination with the transport, (un)loading of stacks and cassettes is also possible. The gripper uses ultrasonic bearing technology to keep the wafer at a distance, thus enabling contactless transport. In addition to micro-scratches and -cracks, contamination by particles is avoided since without compressed air no air turbulence is created. Therefore, the gripper is also very suitable for clean rooms. The LeviWafer-Gripper can be designed with a single or double paddle. Features of the LeviWafer-Gripper: - Contactless pickup - No micro-scratches, micro-cracks, or particles - Suitable for standard cassettes - Low energy consumption - Customizable according to customer specifications