Processing technology - Import export

Processing Technology: Electrolytic Foil Base Material: Copper Insulation Materials: Epoxy Resin Certification: UL, RoHS, ISO9001, Ts16949 Transport Package: by Vacuum Packing in Cartons Specification: UL, ROHS, SGS Origin:China HS Code: 85340090 Min. Order: 100 Pieces Port: China Production Capacity:100000 Square Meters Per Month Payment Terms: L/C, T/T, D/P Type: Rigid Circuit Board Dielectric:FR-4 Material: Fiberglass Epoxy Application: Consumer Electronics Flame Retardant Properties: V0 Mechanical Rigid: Rigid

The critical process, as well as the parts for semiconductor device, which should be used in high temperature, vacuum and corrosive gas environment, require clean and dustless environment. However, precision ceramic material could maintain high stability in complicated physical and chemical environment. Semiconductor ceramic part we produced with wear resistance, corrosion resistance, low thermal expansion, insulation is made from 99.5% alumina ceramic and shaped by cold isostatic pressing, high temperature sintering and precision machining and polishing, can meet the stringent equirements of parts for semiconductor equipment. Selection of materials Selection of high-quality raw materials, good precision, strict quality control, longer service life Fine structure 20 Years of industry experience, a variety of molding processing technology and production equipment, fine workmanship, tight shape

SINUO is an artistic enterprise involving light art, installation art, sculpture and painting. We have our own team and standard technological process on research and development, production, installation and after-sales service.