Power modules - Import export

● The junction box uses the PPE/PA,High rigidity, high temperature resistance chemical resistance, wear resistance and pollution resistance ● The junction box uses the glue to seal, the waterproof effect is better, the fitting interior heat is better. ● This junction box is a three-part design, and the cable adopts horizontal outlet mode, which can reduce the cable bending stress, save the cable usage, reduce the power loss of PV module, and divide the influence of "hot spot effect" into three parts. The influence of high temperature on photovoltaic modules is reduced. ● The diode and the terminal adopt an integrated packaging mode, and the terminal uses red copper

DBC ceramic substrate: Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm 2.

IO Config V1.0.0.6(Fully with .NET4.0.rar|CT-7221CT-7221 Power Supply Extension Module 5V/2A Module features System Power and Field Power Extension System Power Output 2A@5VDC Field Power Extension 8A Current

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.